Magnetic tunnel junction (MTJ) device and forming method thereof
A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.
1. A method of forming a magnetic tunnel junction (MTJ) device, comprising:
forming a stacked structure of an interlayer comprising a magnetic shielding layer;
etching the stacked structure of interlayer to form recesses in the stacked structure of the interlayer; and
filling the magnetic tunnel junction elements in the recesses, wherein the stacked structure of the interlayer enclosing the magnetic tunnel junction elements, and the magnetic shielding layer comprises diamagnetic materials or paramagnetic materials only overlaps partial sidewalls of the magnetic tunnel junction elements.
2. The method of forming a magnetic tunnel junction (MTJ device according to claim 1 , wherein the stacked structure of the interlayer comprises a lower interlayer dielectric layer and an upper interlayer dielectric layer stacked from bottom to top, wherein the lower interlayer dielectric layer, the magnetic shielding layer and the upper interlayer dielectric layer are stacked arranged.
3. The method of forming a magnetic tunnel junction (MTJ) device according to claim 1 , further comprising:
forming insulators covering sidewalls of the recesses before the magnetic tunnel junction elements are filled.
4. The method of forming a magnetic tunnel junction (MTJ) device according to claim 1 , wherein each of the magnetic tunnel junction elements comprises a bottom electrode, a pin layer, a tunneling barrier layer, a free layer and a top electrode stacked from bottom to top.
5. The method of forming a magnetic tunnel junction (MTJ) device according to claim 4 , wherein the magnetic shielding layer overlaps at least one of an interface of the pin layer and the tunneling barrier layer, and an interface of the free layer and the tunneling barrier layer.
6. The method of forming a magnetic tunnel junction (MTJ) device according to claim 4 , wherein the magnetic shielding layer overlaps the tunneling barrier layer, the pin layer and the tunneling barrier layer, or the free layer and the tunneling barrier layer.
7. The method of forming a magnetic tunnel junction (MTJ) device according to claim 2 , wherein the magnetic shielding layer is sandwiched by the lower interlayer dielectric layer and the upper interlayer dielectric layer.
8. The method of forming a magnetic tunnel junction (MTJ) device according to claim 3 , wherein the magnetic shielding layer comprises a metallic diamagnetic material layer or a Mu metal material layer.
9. The method of forming a magnetic tunnel junction (MTJ) device according to claim 1 , wherein the stacked structure of the interlayer comprises an interlayer dielectric layer, and the interlayer dielectric layer and the magnetic shielding layer are stacked from bottom to top.
10. The method of forming a magnetic tunnel junction (MTJ) device according to claim 1 , wherein the magnetic shielding layer comprises a dielectric diamagnetic material layer.