Thermal management in circuit board assemblies
Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.
1. A method comprising:
providing a printed circuit board (PCB) defined upon a substrate and having one or more vias extending through the substrate between a first face and a second face;
filling the one or more vias with a metal nanoparticle paste composition, the metal nanoparticle paste composition being adapted to limit shrinkage during metal nanoparticle consolidation and comprising one or more organic solvents, metal nanoparticles coated with one or more surfactants, and about 10 wt. % to about 35 wt. % micron-size particles;
wherein at least a portion of the one or more organic solvents have a boiling point higher than that of the one or more surfactants; and
wherein the metal nanoparticle paste composition has a density ranging from about 3.5 g/cm 3 to about 6 g/cm 3 ;
consolidating the metal nanoparticles of the metal nanoparticle paste composition within the one or more vias to form a monolithic metal body filling each of the one or more vias; and
placing a heat sink upon at least one of the first face or the second face, the heat sink contacting each monolithic metal body.
2. The method of claim 1 , wherein the metal nanoparticles comprise copper nanoparticles.
3. The method of claim 2 , wherein the metal nanoparticle paste composition further comprises diamond particles.
4. The method of claim 3 , wherein the metal nanoparticle paste composition further comprises carbon fibers.
5. The method of claim 1 , wherein the micron-scale particles comprise micron-scale metal particles.
6. The method of claim 1 , wherein the monolithic metal body further comprises a plurality of diamond particles.
7. The method of claim 1 , wherein a first heat sink is located upon the first face of the PCB and a second heat sink is located upon the second face of the PCB.
8. The method of claim 7 , wherein the first heat sink and the second heat sink dissipate heat by different mechanisms.
9. The method of claim 1 , wherein at least a portion of the one or more vias are filled using a syringe that contains the metal nanoparticle paste composition.
10. The method of claim 1 , wherein at least a portion of the one or more vias are filled by screen printing the metal nanoparticle paste composition.
11. The method of claim 1 , further comprising:
placing a reinforcement material in at least a portion of the one or more vias prior to filling the one or more vias with the metal nanoparticle paste composition, the reinforcement material extending through at least a portion of the monolithic metal body after consolidation of the metal nanoparticles.
12. The method of claim 1 , wherein the heat sink is placed in contact with the metal nanoparticle paste composition before consolidating the metal nanoparticles, and becomes metallurgically bonded to the monolithic metal body as the metal nanoparticles undergo consolidation.
13. The method of claim 1 , wherein the monolithic metal body has a uniform nanoporosity ranging from about 2% to about 30%.
14. The method of claim 1 , wherein the one or more vias are about 1 mm or larger in diameter.
15. The method of claim 14 , further comprising:
placing a reinforcement material in at least a portion of the one or more vias prior to filling the one or more vias with the metal nanoparticle paste composition, the reinforcement material extending through at least a portion of the monolithic metal body after consolidation of the metal nanoparticles.
16. The method of claim 1 , wherein the metal nanoparticle paste composition further comprises diamond particles and a carbide forming additive effective to form a carbide layer upon the diamond particles.
17. The method of claim 1 , wherein the metal nanoparticle paste composition further comprises carbon fibers.