Multi-layer ceramic electronic component and method of producing the same
A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a capacitance forming unit, a cover, and a side surface. The capacitance forming unit includes ceramic layers that are laminated in a first direction and contain boron, and internal electrodes disposed between the ceramic layers. The cover covers the capacitance forming unit in the first direction. The side surface faces in a second direction orthogonal to the first direction. The side margin covers the side surface in the second direction and has a lower boron concentration than a boron concentration of the ceramic layers.
1. A multi-layer ceramic electronic component, comprising
a multi-layer unit including
a capacitance forming unit including
ceramic layers that are laminated in a first direction and contain boron, and
internal electrodes disposed between the ceramic layers,
a cover that covers the capacitance forming unit in the first direction, and
a side surface that faces in a second direction orthogonal to the first direction; and
a side margin that covers the side surface in the second direction,
wherein the ceramic layers include dielectric ceramics having a Perovskite structure as a main component and further include boron,
wherein the side margin includes a dielectric ceramic having a Perovskite structure as a main component and further includes boron, and
wherein the side margin has a lower boron concentration than a boron concentration of the ceramic layers.
2. The multi-layer ceramic electronic component according to claim 1 , wherein
the capacitance forming unit includes
a first region disposed at the center portion in the second direction, and
a second region that is disposed between the first region and the side margin, the boron concentration of the ceramic layers in the second region being lower than the boron concentration of the ceramic layers in the first region and higher than the boron concentration of the side margin.
3. The multi-layer ceramic electronic component according to claim 2 , wherein
the ceramic layers disposed in the second region has the boron concentration gradually decreasing from a side of the first region toward a side of the side margin.
4. The multi-layer ceramic electronic component according to claim 2 , wherein a dimension of the second region in the second direction is 1 μm or more and is equal to or smaller than 20% of the dimension, in the second direction, of a ceramic body that comprises the multi-layer unit and a pair of side margins.
5. The multi-layer ceramic electronic component according to claim 1 , wherein the dielectric ceramics of the ceramic layers and of the side margin comprise at least one of strontium titanate (SrTiO 3 ) based material, a calcium titanate (CaTiO 3 ) based material, a magnesium titanate (MgTiO 3 ) based material, a calcium zirconate (CaZrO 3 ) based material, a calcium zirconate titanate (Ca(Zr,Ti)O 3 ) based material, a barium zirconate (BaZrO 3 ) based material, and a titanium oxide (TiO 2 ) based material.
6. The multi-layer ceramic electronic component according to claim 5 , wherein the ceramic layers and the side margin have a common main component.