IP Library Granted Patent US 11,239,593
Granted Patent B2
US 11,239,593 · App. 16/270,716 · Granted Feb 1, 2022

Electrical contact element for an electrical connector having microstructured caverns under the contact surface

Inventors: Michael Leidner (Lambrecht, DE); Frank Mucklich (Schwalbach, DE); Leander Reinert (Saarwellingen, DE); Herr Kim Eric Trinh Quoc (Saarbrücken, DE); Helge Schmidt (Speyer, DE); Stefan Thoss (Worms, DE)
Assignees: TE Connectivity Germany GmbH; Steinbeiss-Forschungszentrum
H01R13/03B32B15/01B32B15/018C22C9/00H01R13/533H01R43/005
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Quick Facts
Patent No.
US 11,239,593
App. No.
16/270,716
Granted
Feb 1, 2022
Kind
B2
Abstract

An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.

Claims (27)

1. An electrically conductive contact element for an electrical connector, comprising:

a contact surface having a plurality of caverns arranged under the contact surface in a microstructure; and

an auxiliary material closed within the plurality of caverns by the contact surface arranged directly over each of the plurality of caverns.

2. The electrically conductive contact element of claim 1 , wherein the microstructure extends parallel to the contact surface.

3. The electrically conductive contact element of claim 1 , wherein the caverns form a substantially homogeneous pattern with the microstructure.

4. The electrically conductive contact element of claim 1 , wherein the auxiliary material is selected from the group of an antioxidant, a corrosion protection agent, a lubricant, and an acid.

5. The electrically conductive contact element of claim 1 , wherein the entirety of the auxiliary material is closed under the contact surface.

6. The electrically conductive contact element of claim 1 , wherein the microstructure and the plurality of caverns are formed in a first material, wherein the auxiliary material is closed within the first material.

7. The electrically conductive contact element of claim 1 , wherein the microstructure is formed within a coating applied to a base material of the contact element, wherein the plurality of caverns do not extend into the base material.

8. The electrically conductive contact element of claim 1 , wherein the caverns do not have an output at the contract surface such that the auxiliary material cannot be accessed through the contact surface.

9. The electrically conductive contact element of claim 1 , wherein the microstructure forms a pattern that is periodic at least in sections.

10. The electrically conductive contact element of claim 9 , wherein the microstructure has a period length of 0.5 μm to 300 μm in at least one direction.

11. The electrically conductive contact element of claim 10 , wherein the period length is 1 μm to 100 μm in at least one direction.

12. The electrically conductive contact element of claim 1 , wherein the contact surface has a surface texture configured to reduce the bearing surface between the contact surface and a mating contact surface.

13. The electrically conductive contact element of claim 12 , wherein the surface texture is congruent with the microstructure.

14. The electrically conductive contact element of claim 12 , wherein the surface texture is formed on the contact surface directly above the caverns of the microstructure.

15. An electrical connector, comprising:

an electrically conductive contact element including a contact surface having a plurality of caverns arranged directly under the contact surface in a microstructure and an auxiliary material closed within each of the plurality of caverns by the contact surface arranged directly over each of the plurality of caverns.

16. A method for enclosing an auxiliary material under a contact surface of an electrically conductive contact element, comprising:

forming a microstructure at the contact surface;

applying the auxiliary material onto the contact surface; and

closing the auxiliary material within each of a plurality of caverns formed in the microstructure by forming the contact surface directly above each of the plurality of caverns.

17. The method of claim 16 , wherein the enclosing step includes treating the contact surface with a laser radiation having an interference pattern.

18. The method of claim 16 , wherein the applying step occurs before the forming step.

19. The method of claim 18 , wherein the auxiliary material is enclosed in the microstructure during the forming step.

20. The method of claim 16 , wherein the applying step occurs after the forming step.

21. The method of claim 20 , wherein the enclosing step occurs after the applying step, and wherein the contact surface is mechanically deformed during the enclosing step.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE FIRST INVENTOR IS MICHAEL LEIDNER PREVIOUSLY RECORDED AT REEL: 050472 FRAME: 0969. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Oct 13, 2021
From: LEIDNER, MICHAEL
To: TE CONNECTIVITY GERMANY GMBH; STEINBEISS-FORSCHUNGSZENTRUM
Reel/Frame 058547/0308 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2019
From: MUCKLICH, FRANK; REINERT, LEANDER; TRINH QUOC, HERR KIM ERIC
To: TE CONNECTIVITY GERMANY GMBH; STEINBEISS-FORSCHUNGSZENTRUM
Reel/Frame 050592/0599 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2019
From: LEIDER, MICHAEL; SCHMIDT, HELGE; THOSS, STEFAN
To: TE CONNECTIVITY GERMANY GMBH; STEINBEISS-FORSCHUNGSZENTRUM
Reel/Frame 050472/0969 →
Priority Claims (1)
DE 102016214693.9 · Aug 8, 2016 · national
Continuity (2)
Continuation PCTEP2017070037 · Aug 8, 2017
Related Publication 20190173214A1 · Jun 6, 2019
Cited By (1)
US 12,343,757