IP Library › Granted Patent US 10,838,471
Granted Patent B2
US 10,838,471 · App. 16/271,143 · Granted Nov 17, 2020

System for estimating airflow exiting an information handling system and method therefor

Inventors: Hasnain Shabbir (Round Rock, TX); Brently Lynn Cooper (Mendham, NJ)
Assignee: Dell Products, L.P.
G06F1/206G05B19/042G05B2219/2614
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Quick Facts
Patent No.
US 10,838,471
App. No.
16/271,143
Filed
Feb 8, 2019
Granted
Nov 17, 2020
Kind
B2
Art Unit
2115
USPC
700/276
Abstract

An information handling system includes a baseboard management controller (BMC) storing characterization data identifying a thermal resistance of a system component as a function of airflow. The BMC can perform measurements to determine a thermal resistance of the system component as a function of the speed of a system cooling fan. The BMC can determine a relationship between the fan speed and airflow at the information handling system based on the measurements and the characterization data.

Claims (56)

1. An information handling system comprising:

a first component including a thermal sensor and a heat sink;

a chassis including a first fan to exhaust air from the chassis; and

a baseboard management controller (BMC) to:

receive characterization data identifying:

a first thermal resistance of an instance of the first component at a test fixture, the first thermal resistance corresponding to a first airflow; and

a second thermal resistance of the instance of the first component at the test fixture, the second thermal resistance corresponding to a second airflow;

determine first data including:

a first thermal resistance of the first component at the information handling system, the first thermal resistance corresponding to a first fan speed at the information handling system; and

a second thermal resistance of the first component at the information handling system, the second thermal resistance corresponding to a second fan speed at the information handling system; and

determine a relationship between fan speed and airflow at the information handling system based on the first data and the characterization data.

2. The information handling system of claim 1 , wherein determining the relationship includes determining the first airflow at the information handling system based on the first thermal resistance, the first fan speed, and the characterization data, and determining the second airflow at the information handling system based on the second thermal resistance, the second fan speed, and the characterization data.

3. The information handling system of claim 1 , wherein the BMC is further to estimate airflow exiting the information handling system at a first time based on a fan speed at the information handling system chassis at the first time.

4. The information handling system of claim 1 , wherein the BMC is further to configure a computational workload executing at the information handling system while determining the first data.

5. The information handling system of claim 1 , wherein the BMC is further to:

determine a fan speed at the information handling system at a first time;

determine a measure of airflow exiting the information handling system based on the fan speed at the first time; and

provide the measure of airflow to a data center cooling system.

6. The information handling system of claim 1 , wherein the first component is a central processing unit installed at a main board of the information handling system.

7. The information handling system of claim 1 , wherein the first component is a platform controller hub installed at a main board of the information handling system.

8. The information handling system of claim 1 , wherein the first component is a memory module installed at main board of the information handling system.

9. The information handling system of claim 1 , wherein the BMC is further to generate a linear equation expressing the relationship between fan speed and airflow at the information handling system.

10. A method comprising:

identifying a first component at a first information handling system based on proximity to airflow during operation of the first information handling system;

receiving characterization data identifying:

a first thermal resistance of a first instance of the first component at a test fixture, the first thermal resistance corresponding to a first airflow; and

a second thermal resistance of the first instance of the first component at the test fixture, the second thermal resistance corresponding to a second airflow;

determining first data including:

a first thermal resistance of a second instance of the first component at a second information handling system, the first thermal resistance corresponding to a first fan speed at the second information handling system; and

a second thermal resistance of the second instance of the first component at the second information handling system, the second thermal resistance corresponding to a second fan speed at the second information handling system; and

determining a relationship between fan speed and airflow at the second information handling system based on the first data and the characterization data.

11. The method of claim 10 , wherein determining the relationship comprises:

determining a first airflow at the second information handling system based on the first thermal resistance and the first fan speed at the second information handling system, and based on the characterization data; and

determining a second airflow at the second information handling system based on the second thermal resistance and the second fan speed at the second information handling system, and based on the characterization data.

12. The method of claim 10 , further comprising configuring a computational workload executing at the second information handling system while determining the first data.

13. The method of claim 10 , further comprising:

determining a fan speed at the second information handling system at a first time;

determining a measure of airflow exiting the second information handling system based on the fan speed at the first time; and

providing the measure of airflow to a data center cooling system.

14. The method of claim 10 , further comprising:

generating a lookup table representing the characterization data; and

storing the lookup table at the second information handling system.

15. The method of claim 10 , wherein the first component is a central processing unit installed at a main board of the second information handling system.

16. The method of claim 10 , wherein determining the first data and determining the relationship is performed by a baseboard management controller included at the second information handling system.

17. The method of claim 10 , further comprising generating, at a baseboard management controller, a linear equation expressing the relationship between the fan speed and the airflow at the second information handling system.

18. A method comprising:

receiving characterization data identifying:

a first thermal resistance of a first instance of a first component at a test fixture, the first thermal resistance corresponding to a first airflow; and

a second thermal resistance of the first instance of the first component at the test fixture, the second thermal resistance corresponding to a second airflow;

determining, at a baseboard management controller (BMC) at an information handling system, first data including:

a first thermal resistance of a second instance of the first component at the information handling system, the first thermal resistance corresponding to a first fan speed at the information handling system; and

a second thermal resistance of the second instance of the first component at the information handling system, the second thermal resistance corresponding to a second fan speed at the information handling system;

determining at the BMC a first airflow at the information handling system based on the first thermal resistance and the first fan speed at the information handling system, and based on the characterization data; and

determining at the BMC a second airflow at the information handling system based on the second thermal resistance and the second fan speed at the information handling system, and based on the characterization data.

19. The method of claim 18 , further comprising estimating airflow exiting the information handling system at a first time based on a fan speed at the information handling system chassis at the first time.

20. The method of claim 18 , further comprising configuring a computational workload executing at the information handling system while determining the first data.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (050724/0466) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 060753/0486 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST AT REEL 050405 FRAME 0534 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058001/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 15, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 050724/0466 →
SECURITY AGREEMENT Recorded Sep 17, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 050405/0534 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2019
From: SHABBIR, HASNAIN; COOPER, BRENTLY LYNN
To: DELL PRODUCTS, LP
Reel/Frame 049751/0054 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
Continuity (1)
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