Stage for cutting substrate that includes main stage and dummy stage, substrate-cutting device, and method of operating substrate-cutting device
A substrate-cutting stage includes a main stage and a dummy stage spaced apart from each other with a cutting region interposed therebetween and that support a substrate. The main stage supports a first portion of the substrate, the dummy stage supports a second portion of the substrate, and the cutting region overlaps a to-be-cut portion of the substrate disposed between the first and second portions.
1. A substrate-cutting stage, comprising:
a main stage and a dummy stage spaced apart from each other with a cutting region interposed therebetween and that support a substrate, wherein
the main stage supports a first portion of the substrate,
the dummy stage supports a second portion of the substrate, and
the cutting region overlaps a to-be-cut portion of the substrate disposed between the first and second portions,
wherein the dummy stage is movable in a thickness direction of the substrate.
2. The substrate-cutting stage of claim 1 , wherein the dummy stage encloses the main stage.
3. The substrate-cutting stage of claim 2 , wherein the to-be-cut portion encloses the first portion.
4. The substrate-cutting stage of claim 1 , wherein the dummy stage is rotatable to be inclined at an angle relative to a plane of the main stage.
5. The substrate-cutting stage of claim 1 , wherein the dummy stage exposes one side surface of the main stage and faces other side surfaces of the main stage.
6. The substrate-cutting stage of claim 5 , wherein the dummy stage comprises
a first dummy portion and a second dummy portion that face each other in a first direction, and
a third dummy portion that connects an end of the first dummy portion to an end of the second dummy portion.
7. The substrate-cutting stage of claim 1 , wherein the dummy stage comprises:
a first dummy portion that overlaps a first corner region of the substrate adjacent to a first side surface of the substrate that extends in a first direction and a third side surface of the substrate that extends in a second direction crossing the first direction; and
a second dummy portion that overlaps a second corner region of the substrate adjacent to the third side surface and a second side surface of the substrate that faces and is parallel to the first side surface.
8. The substrate-cutting stage of claim 7 , wherein the cutting region comprises
a first cutting region provided between the first dummy portion and the main stage and
a second cutting region provided between the second dummy portion and the main stage.
9. The substrate cutting stage of claim 8 , wherein
the first cutting region comprises a first cutting line parallel to the first direction and a second cutting line parallel to the second direction, and
the second cutting region comprises a third cutting line parallel to the first direction and a fourth cutting line parallel to the second direction.