IP Library › Granted Patent US 10,863,061
Granted Patent B2
US 10,863,061 · App. 16/275,339 · Granted Dec 8, 2020

Image sensor

Inventors: Yasuhito Uetsuji (Kyoto, JP); Masahiro Takayama (Kyoto, JP)
Assignee: OMRON Corporation
H04N5/22521G03B17/08H04N5/2252H04N5/2254H04N5/2256
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Quick Facts
Patent No.
US 10,863,061
App. No.
16/275,339
Granted
Dec 8, 2020
Kind
B2
Abstract

The disclosure provides a structure for suppressing occurrence of dew condensation on a cover member in an image sensor for industrial use. An image sensor includes an illumination part for illuminating a subject, a lens part for forming an optical image of the subject, an imaging part for generating an image based on the optical image, and a housing for accommodating the illumination part, the lens part, and the imaging part. A light-transmissive cover member covering a front side of the lens part and the illumination part is attached to the housing. A wall member partitioning a space where the lens part is arranged and a space where the illumination part is arranged is provided inside the housing, and the housing has a heat transfer structure for transferring heat generated inside the housing to the cover member.

Claims (22)

1. An image sensor comprising:

an illumination part for illuminating a subject;

a lens part for forming an optical image of the subject;

an imaging part for generating an image based on the optical image; and

a housing for accommodating the illumination part, the lens part, and the imaging part,

wherein a cover member covering a front side of the lens part and the illumination part is attached to the housing, the cover member is light-transmissive, and a wall member partitioning a space where the lens part is arranged and a space where the illumination part is arranged is provided inside the housing, and

the housing has a heat transfer structure for transferring heat generated inside the housing to the cover member,

wherein the housing comprises a case member made of metal,

the case member is in contact with a heating body present inside the housing directly or via a heat conduction member, and the case member is in contact with the cover member directly or via a heat conduction member, so as to form the heat transfer structure,

wherein the case member comprises a plurality of members comprising a first member and a second member which are separable, and

a first sealing member is provided in between the first member and the second member for sealing a gap between the first member and the second member, and a first contact part at which the first member and the second member are in direct contact is formed,

wherein the cover member is fixed to the second member,

wherein a second sealing member is provided for sealing a gap between the second member and the cover member, and a second contact part at which the second member and the cover member are in direct contact is formed,

wherein the cover member is screw-fixed to the second member,

the second sealing member is provided closer to a center of the cover member than a screw fixing position where the cover member is screw-fixed to the second member, and the second contact part is further formed closer to the center of the cover member than the second sealing member.

2. The image sensor according to claim 1 , wherein the second member is attached to the first member while compressing the first sealing member in a first direction, and

the first contact part comprises a first contact surface perpendicular to the first direction and a second contact surface parallel to the first direction.

3. The image sensor according to claim 1 , wherein the second member has an extension part extending toward the heating body and in contact with the heating body directly or via a heat conduction member.

4. The image sensor according to claim 1 , wherein the illumination part comprises a light source and a driving circuit of the light source, and

the heating body comprises at least one of the light source and the driving circuit of the light source.

5. The image sensor according to claim 1 , comprising a processing part comprising a processor for executing processing using the image,

wherein the heating body comprises the processor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2019
From: UETSUJI, YASUHITO; TAKAYAMA, MASAHIRO
To: OMRON CORPORATION
Reel/Frame 048340/0642 →
Priority Claims (1)
JP 2018-047678 · Mar 15, 2018 · national
Continuity (1)
Related Publication 20190289181A1 · Sep 19, 2019
Cited By (1)
US 12,231,752