Circuit module and manufacturing method therefor
A circuit module includes a flat substrate, a frame substrate, a first electronic component, and a first sealing member. First connection electrodes are disposed at a peripheral portion of one main surface of the flat substrate. Second connection electrodes are disposed on one main surface of the frame substrate at locations corresponding to the first connection electrodes. Each of the first connection electrodes and a corresponding one of the second connection electrodes are connected to each other via a first connection member. The first electronic component is sealed by the first sealing member. The first electronic component and the first sealing member are disposed in a cavity defined by the one main surface of the flat substrate and an inner surface of the frame substrate. The first sealing member is separated from the inner surface of the frame substrate.
1. A circuit module comprising:
a flat substrate having a plurality of first connection electrodes disposed at a peripheral portion of one main surface of the flat substrate;
a frame substrate having a plurality of second connection electrodes disposed on one main surface of the frame substrate at locations corresponding to the first connection electrodes;
a first electronic component; and
a first sealing member, wherein
each of the first connection electrodes and a corresponding one of the second connection electrodes are connected to each other via a first connection member,
the first electronic component is completely sealed by the first sealing member, and no portion of the first electronic component is exposed from the first sealing member,
the first electronic component and the first sealing member are disposed in a cavity defined by the one main surface of the flat substrate and an inner surface of the frame substrate, and
the first sealing member is separated from the inner surface of the frame substrate,
wherein the first connection member contains a metal material containing Sn, and the first connection member, a corresponding one of the first connection electrodes and a corresponding one of the second connection electrodes are sealed by an electrically insulating resin member.
2. The circuit module according to claim 1 , wherein the first sealing member contains a photo-curing resin material.
3. The circuit module according to claim 2 , wherein the first connection member contains a metal material having a melting point of 900 degrees C. or higher.
4. The circuit module according to claim 2 , wherein the first connection member contains an anisotropic conductive resin material, and seals a corresponding one of the first connection electrodes and a corresponding one of the second connection electrodes.
5. The circuit module according to claim 2 , wherein a metal film is disposed on a surface of the first sealing member opposite to a surface of the first sealing member facing to the one main surface of the flat substrate.
6. The circuit module according to claim 1 , wherein the first connection member contains a metal material having a melting point of 900 degrees C. or higher.
7. The circuit module according to claim 6 , wherein a metal film is disposed on a surface of the first sealing member opposite to a surface of the first sealing member facing to the one main surface of the flat substrate.
8. The circuit module according to claim 1 , wherein the first connection member contains an anisotropic conductive resin material, and seals a corresponding one of the first connection electrodes and a corresponding one of the second connection electrodes.
9. The circuit module according to claim 8 , wherein a metal film is disposed on a surface of the first sealing member opposite to a surface of the first sealing member facing to the one main surface of the flat substrate.
10. The circuit module according to claim 1 , wherein a metal film is disposed on a surface of the first sealing member opposite to a surface of the first sealing member facing to the one main surface of the flat substrate.