High-volume millimeter scale manufacturing
A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking the photoresist material, exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.
1. A high-speed method for forming a millimeter-scale linkage laminate structure comprising:
providing a first ply of relatively rigid mechanical material, said first ply having a first surface region and a second surface region disposed in substantially parallel spaced relation to said first surface region;
coupling said first surface region of said first ply to a second ply of sacrificial film carrier material;
applying a patterned photoresist material to said second surface region;
selectively etching said first ply to form at least one substrate island and at least one chip island, said substrate and chip islands being respectively coupled to said second ply of sacrificial film carrier material;
selectively coupling said at least one substrate island to a relatively flexible ply material to form said linkage laminate structure; and
removing said second ply of sacrificial film carrier material to release said linkage laminate structure from said sacrificial film carrier material and said at least one chip island.
2. A high-speed method as defined in claim 1 wherein said second ply of sacrificial film carrier material comprises a soluble film material and where said removing said second ply of sacrificial film carrier material comprises dissolving said sacrificial film carrier material.
3. A high-speed method as defined in claim 2 wherein said soluble film material comprises an isopropynol-soluble material.
4. A high-speed method as defined in claim 1 wherein said second ply of sacrificial film carrier material comprises a thermally decomposing film material and where said removing said second ply of sacrificial film carrier material comprises decomposing said sacrificial film carrier material.
5. A high-speed method as defined in claim 4 wherein said decomposing said sacrificial film carrier material comprises chemically decomposing said sacrificial film carrier material.
6. A high-speed method as defined in claim 4 wherein said decomposing said sacrificial film carrier material comprises evaporating said sacrificial film carrier material.
7. A high-speed method as defined in claim 1 wherein said second ply of sacrificial film carrier material comprises a melting film material and where said removing said second ply of sacrificial film carrier material comprises heating said sacrificial film carrier material.
8. A high-speed method as defined in claim 7 wherein said melting film material comprises a hot melt material.
9. A high-speed method as defined in claim 7 wherein said melting film material comprises a wax material.
10. A high-speed method as defined in claim 1 wherein said second ply of sacrificial film carrier material comprises a biodegradable film material.
11. A high-speed method as defined in claim 10 wherein said biodegradable film material comprises a biodegradable polyethylene terephthalate (PET) material.
12. A high-speed method as defined in claim 1 wherein said first ply of relatively rigid mechanical material comprises a metallic material.
13. A high-speed method as defined in claim 1 wherein said selectively etching said first ply comprises etching said first ply in a batch processing tank system.
14. A high-speed method as defined in claim 1 wherein said selectively coupling said at least one substrate island to a relatively flexible ply material comprises adhesive jet printing an adhesive material onto a surface region of said at least one substrate island and, thereafter, disposing said relatively flexible ply material into contact with said adhesive material.
15. A high-speed method as defined in claim 1 wherein said selectively coupling said at least one substrate island to a relatively flexible ply material comprises disposing a die cut adhesive film onto a surface region of said at least one substrate island and, thereafter, disposing said relatively flexible ply material into contact with said die cut adhesive film.
16. A high-speed method as defined in claim 1 wherein said selectively coupling said at least one substrate island to a relatively flexible ply material comprises adhesive transfer printing an adhesive material onto a surface region of said at least one substrate island and, thereafter, disposing said relatively flexible ply material into contact with said adhesive material.
17. A high-speed method as defined in claim 1 wherein said selectively coupling said at least one substrate island to a relatively flexible ply material comprises adhesive spraying an adhesive material onto a surface region of said at least one substrate island and, thereafter, disposing said relatively flexible ply material into contact with said adhesive material.
18. A high-speed method as defined in claim 1 wherein said selectively coupling said at least one substrate island to a relatively flexible ply material comprises screen printing an adhesive material onto a surface region of said at least one substrate island and, thereafter, disposing said relatively flexible ply material into contact with said adhesive material.