Monolithic EML with electrically isolated electrodes

1. An apparatus comprising:

a substrate;

a laser element comprising a laser core component, a laser top electrode, and a laser bottom electrode, wherein:

the laser element resides over the substrate; and

the laser core component is vertically aligned between the laser top electrode and the laser bottom electrode, wherein the laser bottom electrode is over the substrate, the laser core component is over the laser bottom electrode, and the laser top electrode is over the laser core component; and

an electro-absorption modulator (EAM) comprising: a modulator core component, a modulator top electrode, and a modulator bottom electrode, wherein:

the EAM resides over the substrate;

the modulator core component is vertically aligned between the modulator top electrode and the modulator bottom electrode, wherein the modulator bottom electrode is over the substrate, the modulator core component is over the modulator bottom electrode, and the modulator top electrode is over the modulator core component;

at least portions of the substrate, which are directly under the laser bottom electrode and directly under the modulator bottom electrode, are electrically non-conductive; and

the laser top electrode is isolated from the modulator top electrode, and the laser bottom electrode is isolated from the modulator bottom electrode.

2. The apparatus of claim 1 wherein the substrate is electrically non-conductive and formed of one of a group consisting of Indium phosphide (InP), Gallium Arsenide (GaAs), or Silicon (Si).

3. The apparatus of claim 1 further comprising a high resistance region, which resides over the substrate and separates the laser bottom electrode and the modulator bottom electrode.

4. The apparatus of claim 3 wherein the laser bottom electrode and the modulator bottom electrode are surrounded by the high resistance region individually.

5. The apparatus of claim 3 wherein the high resistance region is formed of a same material as the substrate.

6. The apparatus of claim 3 wherein the high resistance region is formed of a different material from the substrate, and has a resistivity greater than 1000 ohms per square.

7. The apparatus of claim 1 wherein the laser core component and the modulator core component are formed within a device block, which is vertically between the laser top electrode and the laser bottom electrode, and vertically between the modulator top electrode and the modulator bottom electrode.

8. The apparatus of claim 7 wherein:

a first portion of the laser bottom electrode is underneath the device block, and a second portion of the laser bottom electrode extends beyond the device block and is exposed over the substrate; and

a first portion of the modulator bottom electrode is underneath the device block, and a second portion of the modulator bottom electrode extends beyond the device block and is exposed over the substrate.

9. The apparatus of claim 8 wherein:

the laser element further comprises a laser top contact formed over the laser top electrode, and a laser bottom contact formed over the second portion of the laser bottom electrode; and

the EAM further comprises a modulator top contact formed over the modulator top electrode, and a modulator bottom contact formed over the second portion of the modulator bottom electrode.

10. The apparatus of claim 9 further comprising a laser contact support block and a modulator contact support block, wherein:

the laser contact support block is over the substrate and adjacent to a portion of the device block where the laser core component is located;

the modulator contact support block is over the substrate and adjacent to a portion of the device block where the modulator core component is located;

the laser top contact extends beyond the laser top electrode, and over the laser contact support block, such that the laser contact support block provides mechanical support to the laser top contact; and

the modulator top contact extends beyond the modulator top electrode, and over the modulator contact support block, such that the modulator contact support block provides mechanical support to the modulator top contact.

11. The apparatus of claim 10 wherein the laser contact support block and the modulator contact support block are formed of Benzocyclobutene (BCB) or polyimide.

12. The apparatus of claim 7 further comprising a termination resistor formed within the device block, wherein the termination resistor is electrically coupled between the modulator top electrode and the modulator bottom electrode.

13. The apparatus of claim 7 wherein the device block comprises a top cladding layer, a grating layer, a multi-quantum well (MQW) region, and a bottom cladding layer, wherein:

the bottom cladding layer is over the laser bottom electrode and the modulator bottom electrode, the MQW region is over the bottom cladding layer, the grating layer is over the MQW region, the top cladding layer is over the grating layer, and the laser top electrode and the modulator top electrode are over the top cladding layer;

the laser core component is formed within the MQW region and the grating layer; and

the modulator core component is formed within the MQW region.

14. The apparatus of claim 13 wherein:

the top cladding layer, the laser top electrode, and the modulator top electrode have a same polarity;

the bottom cladding layer, the laser bottom electrode, and the modulator bottom electrode have a same polarity; and

the bottom cladding layer has an opposite polarity from the top cladding layer.

15. The apparatus of claim 13 wherein the grating layer comprises a plurality of grating elements, which are included in the laser core component and aligned underneath the laser top electrode.

16. The apparatus of claim 1 further comprising a photodetector over the substrate, wherein:

the photodetector and the EAM are located at opposite sides of the laser element;

the photodetector includes a detector bottom electrode over the substrate, a detector core component over the detector bottom electrode, and a detector top electrode over the detector core component;

at least a portion of the substrate directly under the detector bottom electrode is electrically non-conductive; and

the detector top electrode, the modulator top electrode, and the laser top electrode are isolated from each other, and the detector bottom electrode, the modulator bottom electrode, and the laser bottom electrode are isolated from each other.

17. The apparatus of claim 16 further comprising a high resistance region, which resides over the substrate, and separates the laser bottom electrode, the modulator bottom electrode, and the detector bottom electrode from each other.

18. The apparatus of claim 17 wherein the laser bottom electrode, the modulator bottom electrode, and the detector bottom electrode are surrounded by the high resistance region individually.

19. The apparatus of claim 17 wherein the high resistance region is formed of a same material as the substrate.

20. The apparatus of claim 17 wherein the high resistance region is formed of a different material from the substrate, and has a resistivity greater than 1000 ohms per square.

21. The apparatus of claim 16 wherein the laser core component, the modulator core component, and the detector core component are formed within a device block, which is vertically between the laser top electrode and the laser bottom electrode, vertically between the modulator top electrode and the modulator bottom electrode, and vertically between the detector top electrode and the detector bottom electrode.

22. The apparatus of claim 21 wherein the device block comprises a top cladding layer, a grating layer, a multi-quantum well (MQW) region, and a bottom cladding layer, wherein:

the bottom cladding layer is over the laser bottom electrode and the modulator bottom electrode, the MQW region is over the bottom cladding layer, the grating layer is over the MQW region, the top cladding layer is over the grating layer, and the laser top electrode and the modulator top electrode are over the top cladding layer;

the laser core component is formed within the MQW region and the grating layer;

the modulator core component is formed within the MQW region; and

the detector core component is formed within the MQW region, and vertically aligned between the detector top electrode and the detector bottom electrode.