Multilayer ceramic electronic component and method of manufacturing the same
A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8≤T 2 /T 1 ≤1.2, where T 1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T 2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.
1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers and internal electrodes stacked to be alternately exposed to a first end surface and a second end surface of the ceramic body with respective dielectric layers interposed therebetween; and
external electrodes disposed on external surfaces of the ceramic body,
wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively,
0.8≤T 2 /T 1 ≤1.2, where T 1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T 2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned, and
the first electrode layers are connected to the seed layers in contact portions between the at least one surface of the ceramic body in the thickness direction and the at least one surface of the ceramic body in a length direction,
wherein the first electrode layers and the seed layers directly contact each other without a gap.
2. The multilayer ceramic electronic component of claim 1 , wherein the first electrode layers and the seed layers are connected to each other in corner portions of the ceramic body.
3. The multilayer ceramic electronic component of claim 1 , wherein 0.4≤ T 3 /T 1 ≤1.0, where T 3 is a thickness of each of the first electrode layers in corner portions of the ceramic body.
4. The multilayer ceramic electronic component of claim 1 , wherein the first electrode layers are disposed on first and second end surfaces of the ceramic body in a length direction, respectively.
5. The multilayer ceramic electronic component of claim 1 , wherein the first electrode layers extend to portions of upper surfaces of the seed layers.
6. The multilayer ceramic electronic component of claim 1 , wherein the seed layers are only disposed on one surface of the ceramic body in the thickness direction.
7. The multilayer ceramic electronic component of claim 6 , wherein the one surface of the ceramic body in the thickness direction is a mounting surface of the multilayer ceramic electronic component mounted on a board.
8. The multilayer ceramic electronic component of claim 6 , wherein the plating layers are disposed on first and second end surfaces of the ceramic body in a length direction, and extend to the one surface of the ceramic body in the thickness direction.
9. A multilayer ceramic electronic component comprising:
a ceramic body in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween; and
external electrodes formed on surfaces of the ceramic body to be connected to the internal electrodes,
wherein the external electrodes include seed layers formed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes, and plating layers disposed on the seed layers and the first electrode layers,
the first electrode layers are formed on only end surfaces of the ceramic body in a length direction of the ceramic body, and
the first electrode layers and the seed layers directly contact each other without a gap.
10. The multilayer ceramic electronic component of claim 9 , wherein 0.8≤T 2 /T 1 ≤1.2, where T 1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T 2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.
11. The multilayer ceramic electronic component of claim 9 , wherein 0.4≤T 3 /T 1 ≤1.0, where T 3 is a thickness of each of the first electrode layers in corner portions of the ceramic body.
12. The multilayer ceramic electronic component of claim 9 , wherein the external electrodes are not formed on both surfaces of the ceramic body in the width direction of the ceramic body.
13. The multilayer ceramic electronic component of claim 9 , wherein the seed layers include first and second seed layers formed on a top surface of the ceramic body in the thickness direction, and third and fourth seed layers formed on a bottom surface of the ceramic body in the thickness direction,
the first and second seed layers are disposed at opposite ends of the top surface of the ceramic body in the thickness direction, and
the third and fourth seed layers are disposed at opposite ends of the bottom surface of the ceramic body in the thickness direction.