Thermally conductive curing process for composite rotorcraft structure fabrication
A thermally conductive curing process adds conductive additives to create pathways for dissipating heat during a curing process, thereby reducing the cure time, increasing the output capability, and reducing cost. Conductive particles or short fibers can be dispersed throughout the resin system or composite fiber layers in pre-impregnated or RTM-processed composite material. By disposing conductive particles or short fibers in a resin as part of the curing process, heat generated during the curing process can dissipate more quickly from any type of composite, especially thick composites. Conductive additive examples include multi-walled carbon nanotubes (MWCNTs), single-walled carbon nanotubes (SWCNTs), graphene/graphite powder, buckyballs, short fibrous particulate, nano-clays, nano-particles, and other suitable materials.
1. A thermally conductive curing process, comprising:
assembling a composite preform using a plurality of composite fiber layers;
disposing at least a first portion of conductive additives in a resin to form a conductive resin;
injecting the conductive resin between the plurality of composite fiber layers;
disposing at least a second portion of the conductive additives, without the conductive resin, as a surface layer between a bagging material and the plurality of composite fiber layers, wherein the surface layer is separate from the bagging material and the plurality of composite fiber layers;
disposing the bagging material over the plurality of composite fiber layers to facilitate a vacuum compaction for material bonding;
subjecting the composite preform to a curing cycle;
wicking away heat from the composite preform via the conductive resin;
maintaining a temperature of the plurality of composite fiber layers below a predetermined threshold; and
minimizing or eliminating temperature dwell times,
wherein the curing cycle includes:
holding a heating temperature constant until a first time,
raising the heating temperature until a second time,
ceasing the raising of the heating temperature and dwelling at a second temperature to mitigate the build-up of heat, and
decreasing the heating temperature at a third time to a final temperature, wherein the final temperature is lower than the second temperature.
2. The curing process of claim 1 , wherein the composite preform is an aircraft structure.
3. The curing process of claim 1 , wherein the plurality of composite fiber layers includes plastic fibers, carbon fibers, aramid fibers, or glass fibers.
4. The curing process of claim 1 , wherein the resin is polyester, epoxy, polyimide, or bismaleimide.
5. The curing process of claim 1 , wherein the conductive additives include conductive particles or conductive short fibers.
6. The curing process of claim 5 , wherein the conductive particles include graphene powder, graphite powder, buckyballs, nano-clays, or nano-particles.
7. The curing process of claim 5 , wherein the conductive short fibers include multi-walled carbon nanotubes (MWCNTs), single-walled carbon nanotubes (SWCNTs), or short fibrous particulate.
8. A thermally conductive curing process, comprising:
disposing at least a first portion of conductive additives in a resin to form a conductive resin;
disposing the conductive resin between a plurality of composite layers;
disposing at least a second portion of the conductive additives, without the conductive resin, as a surface layer between a bagging material and the plurality of composite fiber layers, wherein the surface layer is separate from the bagging material and the plurality of composite fiber layers
disposing the bagging material over the plurality of composite fiber layers to facilitate a vacuum compaction for material bonding;
curing a composite preform comprising the plurality of composite fiber layers in an autoclave, oven, or press;
wicking away heat from the plurality of composite layers via the conductive resin; and
maintaining a temperature of the plurality of composite layers below a predetermined threshold without temperature dwell times,
wherein the curing cycle includes:
holding a heating temperature constant until a first time,
raising the heating temperature until a second time,
ceasing the raising of the heating temperature and dwelling at a second temperature to mitigate the build-up of heat, and
decreasing the heating temperature at a third time to a final temperature, wherein the final temperature is lower than the second temperature.
9. The curing process of claim 8 , wherein the composite preform is an aircraft structure.
10. The curing process of claim 8 , wherein the resin is polyester, epoxy, polyimide, or bismaleimide.
11. The curing process of claim 8 , wherein the conductive additives include conductive particles or conductive short fibers.
12. The curing process of claim 11 , wherein the conductive particles include graphene powder, graphite powder, buckyballs, nano-clays, or nano-particles.
13. The curing process of claim 11 , wherein the conductive short fibers include multi-walled carbon nanotubes (MWCNTs), single-walled carbon nanotubes (SWCNTs), or short fibrous particulate.