Photonics package integration

1. An optical interconnect system, comprising:

a photonics die (pDie) and an integrated switch ASIC integrated into one package, wherein:

the pDie comprises a detector; and

the integrated switch ASIC is attached to the pDie and the integrated switch ASIC and the pDie are arranged in a diving board configuration such that a portion of the pDie extends beyond an edge of the integrated switch ASIC; and

the integrated switch ASIC comprises:

a switch ASIC comprising one or more switches; and

one or more components of an electronics die (eDie) comprising at least one of serializer/deserializer circuitry or control circuitry, wherein the one or more components of the eDie are electrically connected to the pDie;

a substrate attached to the integrated switch ASIC; and

a lens disposed in an opening in the substrate and optically aligned with a light source.

2. The optical interconnect system of claim 1 , wherein the pDie further comprises the light source.

3. The optical interconnect system of claim 1 , wherein:

the substrate comprises a first substrate; and

the first substrate is attached to a second substrate, the second substrate comprising an embedded waveguide that is optically aligned with the lens.

4. The optical interconnect system of claim 1 , wherein a heat spreader is positioned over the pDie and the integrated switch ASIC and attached to one of the first substrate or the second substrate.

5. The optical interconnect system of claim 1 , wherein:

the substrate comprises a first substrate; and

the first substrate is attached to a second substrate and the light source is disposed in the second substrate and optically aligned with an embedded waveguide in the second substrate.

6. The optical interconnect system of claim 5 , wherein:

the lens comprises a first lens;

the embedded waveguide comprises a first embedded waveguide that is optically aligned with the first lens; and

the optical interconnect system further comprises:

a second embedded waveguide disposed in the second substrate and optically aligned with the detector; and

a second lens disposed in a second opening in the first substrate and optically aligned with the second embedded waveguide.

7. A device, comprising:

a substrate;

a plurality of lenses positioned in openings in the substrate; and

an interconnect package connected to the substrate, the interconnect package comprising a photonics die (pDie) and an integrated switch ASIC integrated into one package, wherein:

the integrated switch ASIC includes one or more switches and is configured for control, serializer/deserializer and switch functions; and

the photonic die (pDie) comprises a plurality of detectors and is attached and electrically connected to the integrated switch ASIC, wherein the pDie is positioned between the substrate and the integrated switch ASIC and is attached to a surface of the integrated switch ASIC and arranged such that a portion of the pDie extends beyond an edge of the integrated switch ASIC.

8. The device of claim 7 , wherein:

the substrate comprises a first substrate;

the pDie further comprises a plurality of light sources; and

the device further comprises:

a second substrate attached to the first substrate; and

a plurality of waveguides embedded in the second substrate, wherein a portion of the plurality of waveguides is optically aligned with the plurality of light sources to propagate light emitted by the light sources to optical interconnects.

9. The device of claim 8 , wherein the plurality of lenses in the openings in the first substrate are optically aligned with the portion of the waveguides and the light sources to direct light emitted by the light sources to the portion of the waveguides.

10. The device of claim 8 , wherein the plurality of lenses in the openings in the first substrate are optically aligned with a portion of the plurality of waveguides and the detectors to direct light to the detectors.

11. The device of claim 8 , wherein the plurality of light sources and the plurality of detectors are arranged in pairs of a light source and a detector and the pairs are positioned in one or more clusters in the pDie.

12. The device of claim 7 , wherein:

the substrate comprises a first substrate; and

the device further comprises:

a second substrate attached to the first substrate; and

a plurality of light sources disposed in the second substrate.

13. The device of claim 12 , wherein each lens in the plurality of lenses is optically aligned with a light source in the plurality of light sources.

14. A method for producing an interconnect device for optical communications, the method comprising:

attaching a photonics die (pDie) to a surface of an integrated switch ASIC to produce an interconnect package, the pDie comprising a detector and the integrated switch ASIC comprising one or more switches, serializer/deserializer circuitry, and control circuitry, wherein the pDie is attached to the surface of the integrated switch ASIC such that a portion of the pDie extends beyond an edge of the integrated switch ASIC and the serializer/deserializer circuitry and the control circuitry are electrically connected to the pDie;

positioning a lens in an opening of a substrate; and

attaching the interconnect package to the substrate, wherein the pDie is positioned between the substrate and the integrated switch ASIC and the lens is optically aligned with the detector in the pDie.

15. The method of claim 14 , wherein:

the substrate comprises a first substrate;

the opening in the first substrate comprises a first opening;

the lens comprises a first lens;

the pDie comprises a light source; and

the method further comprises positioning a second lens in a second opening of the first substrate, wherein the second lens is optically aligned with the light source.

16. The method of claim 14 , wherein:

the substrate comprises a first substrate; and

the method further comprises attaching the first substrate to a second substrate comprising a light source.