IP Library Granted Patent US 10,879,438
Granted Patent B2
US 10,879,438 · App. 16/282,772 · Granted Dec 29, 2020

Light emitting module and manufacturing method of light emitting module

Inventor: Tsuyoshi Abe (Hokkaido, JP)
Assignee: Toshiba Hokuto Electronics Corporation
H01L33/56H01L25/0753H01L33/54H01L33/62H01L2933/005H01L2933/0016H01L2933/0033
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Quick Facts
Patent No.
US 10,879,438
App. No.
16/282,772
Granted
Dec 29, 2020
Kind
B2
Abstract

According to one embodiment, a light emitting module includes a first insulating film having optical transparency, a second insulating film arranged facing the first insulating film and having optical transparency, a conductor layer formed on the first insulating film, and a plurality of light emitting elements arranged between the first insulating film and the second insulating film and connected to the conductor layer in a first surface on one side. Each of the plurality of light emitting elements including a first electrode in which a height from a second surface opposite to the first surface is a first height and a second electrode in which a height from the second surface is a second height. The plurality of light emitting elements are arranged such that a distance between the first electrodes of adjacent light emitting elements is smaller than a distance between the second electrodes.

Claims (45)

1. A light emitting module, comprising:

a first insulating film having optical transparency;

a second insulating film arranged facing the first insulating film and having optical transparency;

a conductor layer formed on the first insulating film; and

a plurality of light emitting elements arranged between the first insulating film and the second insulating film and connected to the conductor layer in a first surface on one side, each of the plurality of light emitting elements including a first electrode in which a height from a second surface opposite to the first surface is a first height and a second electrode in which a height from the second surface is a second height,

wherein the plurality of light emitting elements are arranged such that a distance between the first electrodes of adjacent light emitting elements is smaller than a distance between the second electrodes.

2. The light emitting module according to claim 1 , further comprising a resin layer between the first insulating film and the second insulating film.

3. The light emitting module according to claim 2 , wherein the resin layer is a material having at least one of thermosetting property and thermal plasticity.

4. The light emitting module according to claim 1 , wherein, in the plurality of light emitting elements, the first height is higher than the second height.

5. The light emitting module according to claim 1 , wherein the plurality of light emitting elements include a first light emitting element to emit light of a first color and a second light emitting element to emit light of a second color different from the first color.

6. The light emitting module according to claim 5 , wherein the plurality of light emitting elements include a first light emitting element to emit red light, a second light emitting element to emit green light, and a third light emitting element to emit blue light.

7. A light emitting module, comprising:

a first insulating film having optical transparency;

a second insulating film arranged facing the first insulating film and having optical transparency;

a conductor layer formed on the first insulating film; and

three or more light emitting elements arranged between the first insulating film and the second insulating film and connected to the conductor layer in a first surface on one side, each of the three or more light emitting elements including a first electrode in which a height from a second surface opposite to the first surface is a first height and a second electrode in which a height from the second surface is a second height;

a first bump formed in the first electrode; and

a second bump formed in the second electrode,

wherein, in the three or more light emitting elements, the first height is higher than the second height, and the respective first electrodes are linearly arranged, and

wherein the respective bumps bite into the conductor layer at the same depth.

8. The light emitting module according to claim 1 , wherein, in the plurality of light emitting elements, the respective first electrodes are arranged on the same circumference.

9. The light emitting module according to claim 8 , wherein the plurality of light emitting elements include four light emitting elements and are arranged to be horizontally symmetrical with respect to a center of the circumference.

10. The light emitting module according to claim 9 , wherein the four light emitting elements include two first light emitting elements to emit red light, one second light emitting element to emit green light, and one third light emitting element to emit blue light.

11. The light emitting module according to claim 10 , wherein one first light emitting element out of the two first light emitting elements to emit red light is not electrically connected.

12. A light emitting module, comprising:

a first insulating film having optical transparency;

a second insulating film arranged facing the first insulating film and having optical transparency;

a conductor layer formed on the first insulating film;

a plurality of light emitting elements arranged between the first insulating film and the second insulating film and connected to the conductor layer in a first surface on one side, each of the plurality of light emitting elements including a first electrode in which a height from a second surface opposite to the first surface is a first height and a second electrode in which a height from the second surface is a second height;

a first bump formed in the first electrode; and

a second bump formed in the second electrode,

wherein a height of the first bump from the second surface is equal to a height of the second bump from the second surface, and

wherein the first and second bumps bite into the conductor layer with substantially the same degree.

13. The light emitting module according to claim 1 , wherein a difference in contact area between each of the first electrode and the second electrode of the plurality of light emitting elements and the conductor layer is 1500 μm 2 or less.

14. The light emitting module according to claim 7 , wherein a difference in contact area between each of the first electrode and the second electrode of the three or more light emitting elements and the conductor layer is 1500 μm 2 or less.

15. The light emitting module according to claim 12 , wherein a difference in contact area between each of the first electrode and the second electrode of the plurality of light emitting elements and the conductor layer is 1500 μm 2 or less.

16. A manufacturing method of a light emitting module, comprising:

arranging a resin film overlapping a conductor layer in a first insulating film having optical transparency, the conductor layer being formed on one side of the first insulating film;

arranging a plurality of light emitting elements connected to the conductor layer in a first surface on one side on the resin film and including a first electrode in which a height from a second surface opposite to the first surface is a first height and a second electrode in which a height from the second surface is a second height such that a distance between the first electrodes of adjacent light emitting elements is smaller than a distance between the second electrodes;

arranging a second insulating film having optical transparency to face the first insulating film with the plurality of light emitting elements interposed between the first insulating film and the second insulating film; and

clamping the first insulating film and the second insulating film.

17. The manufacturing method of the light emitting module according to claim 16 , wherein, in a case in which the first height is higher than the second height, when arranging the light emitting elements, the first electrodes of three or more light emitting elements are linearly arranged.

18. The manufacturing method of the light emitting module according to claim 16 , wherein, in a case in which the first height is higher than the second height, when arranging the light emitting elements, the first electrodes of the plurality of light emitting elements are arranged on the same circumference.

19. The manufacturing method of the light emitting module according to claim 18 , further comprising:

arranging at least one light emitting element being not electrically connected when arranging the light emitting elements.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2021
From: TOSHIBA HOKUTO ELECTRONICS CORPORATION
To: NICHIA CORPORATION
Reel/Frame 058223/0932 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2019
From: ABE, TSUYOSHI
To: TOSHIBA HOKUTO ELECTRONICS CORPORATION
Reel/Frame 048438/0421 →
Priority Claims (1)
JP 2018-114378 · Jun 15, 2018 · national
Continuity (1)
Related Publication 20190386188A1 · Dec 19, 2019