IP Library Granted Patent US 11,796,912
Granted Patent B2
US 11,796,912 · App. 16/287,228 · Granted Oct 24, 2023

Radiation-sensitive composition and pattern-forming method

Inventor: Motohiro Shiratani (Tokyo, JP)
Assignee: JSR CORPORATION
G03F7/0043G03F7/0042G03F7/0045G03F7/162G03F7/168G03F7/2004G03F7/2037G03F7/322G03F7/325
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Quick Facts
Patent No.
US 11,796,912
App. No.
16/287,228
Granted
Oct 24, 2023
Kind
B2
Abstract

A radiation-sensitive composition contains: particles that include a metal oxide, a cation that includes a metal, an anion. The anion is preferably a conjugated base of an acid and the acid has preferably a pKa of no greater than 3. The content of the particles in terms of solid content equivalent is preferably no less than 50% by mass, and more preferably no less than 70% by mass. The hydrodynamic radius of the particles as determined by a dynamic light scattering analysis is preferably no greater than 10 nm. The total content of the cation and the anion with respect to 100 parts by mass of the particles is preferably no less than 5 parts by mass. The acid is preferably sulfonic acid, nitric acid, organic azinic acid, disulfonylimidic acid or a combination thereof.

Claims (27)

1. A radiation-sensitive composition, comprising:

particles comprising a metal oxide;

a metal cation of M n+ where M is a metal, and n is an integer of not less than 1; and

an anion,

wherein a content of the particles is no less than 50% by mass with respect to a total solid content of the radiation-sensitive composition, and the radiation-sensitive composition does not contain a radiation-sensitive acid generator.

2. The radiation-sensitive composition according to claim 1 , wherein the anion is a conjugate base of an acid, and the acid has a pKa of no greater than 3.

3. The radiation-sensitive composition according to claim 2 , wherein the acid is a sulfonic acid, a nitric acid, an organic azinic acid, a disulfonylimidic acid or a combination thereof.

4. The radiation-sensitive composition according to claim 2 , wherein the content of the particles is in a range of 50% by mass to 99% by mass with respect to the total solid content of the radiation-sensitive composition.

5. The radiation-sensitive composition according to claim 1 , wherein the content of the particles is in a range of 50% by mass to 99% by mass with respect to the total solid content of the radiation-sensitive composition.

6. The radiation-sensitive composition according to claim 5 , wherein the content of the particles is no less than 70% by mass with respect to the total solid content of the radiation-sensitive composition.

7. The radiation-sensitive composition according to claim 1 , wherein a hydrodynamic radius of the particles as determined by a dynamic light scattering analysis is no greater than 10 nm.

8. The radiation-sensitive composition according to claim 1 , wherein a total content of the metal cation and the anion with respect to 100 parts by mass of the particles is no less than 5 parts by mass.

9. The radiation-sensitive composition according to claim 1 , wherein a content of the metal cation is in a range of 0.1 parts by mass to 30 parts by mass with respect to 100 parts by mass of the particle.

10. The radiation-sensitive composition according to claim 1 , wherein a content of the metal cation is in a range of 0.5 parts by mass to 20 parts by mass with respect to 100 parts by mass of the particle.

11. The radiation-sensitive composition according to claim 1 , wherein the metal cation is a cation of zinc, barium, lanthanum, yttrium, or indium.

12. The radiation-sensitive composition according to claim 1 , wherein a metal salt comprises the metal cation and the anion.

13. A pattern-forming method, comprising:

applying the radiation-sensitive composition of claim 1 directly or indirectly on an upper face side of a substrate such that a film comprising the radiation-sensitive composition is formed on the substrate;

exposing the film comprising the radiation-sensitive composition to a radioactive ray; and

developing the film with a developer solution after the exposing of the film to the radioactive ray.

14. The pattern-forming method according to claim 13 , wherein the developer solution in the developing is an alkaline aqueous solution.

15. The pattern-forming method according to claim 13 , wherein the developer solution in the developing is an organic solvent-containing liquid.

16. The pattern-forming method according to claim 13 , wherein the radioactive ray in the exposing is an extreme ultraviolet ray or an electron beam.

17. The radiation-sensitive composition according to claim 1 , wherein the anion is a conjugate base of an acid, and the acid has a pKa in a range of 3 to −8.

18. The radiation-sensitive composition according to claim 1 , wherein the anion is a conjugate base of an acid, and the acid has a pKa in a range of 2 to −6.

19. The radiation-sensitive composition according to claim 1 , wherein a hydrodynamic radius of the particles as determined by a dynamic light scattering analysis is no greater than 10 nm, and a total content of the metal cation and the anion with respect to 100 parts by mass of the particles is no less than 5 parts by mass.

20. The radiation-sensitive composition according to claim 1 , wherein a hydrodynamic radius of the particles as determined by a dynamic light scattering analysis is no greater than 10 nm, a content of the metal cation is in a range of 0.1 parts by mass to 30 parts by mass with respect to 100 parts by mass of the particle, and a total content of the metal cation and the anion with respect to 100 parts by mass of the particles is no less than 5 parts by mass.

Assignments (3)
MERGER Recorded Mar 23, 2026
From: JSR CORPORATION
To: JICC-02, CO., LTD
Reel/Frame 075191/0149 →
CHANGE OF NAME Recorded Mar 23, 2026
From: JICC-02 CO., LTD
To: JSR CORPORATION
Reel/Frame 075192/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2019
From: SHIRATANI, MOTOHIRO
To: JSR CORPORATION
Reel/Frame 048939/0176 →
Priority Claims (1)
JP 2016-166811 · Aug 29, 2016 · national
Continuity (2)
Continuation PCTJP2017031011 · Aug 29, 2017
Related Publication 20190227432A1 · Jul 25, 2019