Interposer with high bandwidth connections between a central processor and memory
An apparatus includes a processor having an array of processor interconnects arranged to connect the processor to conductive paths, a circuit substrate having an array of circuit interconnects arranged to provide connections between the processor and the circuit substrate, the circuit substrate having conductive paths connected to the array of circuit interconnects, an interposer substrate arranged between the processor and the circuit substrate, at least one conductive trace in the interposer substrate in connection with at least one processor interconnect in the array of interconnects on the processor, the conductive trace arranged at least partially parallel to the interposer substrate such that no electrical connection exists between the conductive trace in the interposer substrate and a corresponding one of the circuit interconnects on the circuit substrate, and at least one peripheral circuit connected to the at least one conductive trace.
1. A computing device, comprising:
a processor having a first subset of processor interconnects and a second subset of processor interconnects;
a circuit substrate having circuit interconnects, the circuit substrate having no memory connectors but including conductive circuit paths electrically coupled to components mounted on the circuit substrate;
at least one memory device having at least one memory interconnect; and
an interposer substrate, positioned between the processor and the circuit substrate, and physically connected to the processor, the circuit substrate, and the at least one memory device, the interposer substrate comprising:
a first subset of interposer interconnects and a second subset of interposer interconnects on a first side of the interposer substrate, the first subset of interposer interconnects electrically coupled to the first subset of processor interconnects and the second subset of interposer interconnects electrically coupled to the second subset of processor interconnects;
a third subset of interposer interconnects, on a second side of the interposer substrate, electrically connected to the first subset of interposer interconnects by conductive paths through the interposer substrate and electrically coupled to the circuit interconnects; and
a fourth subset of interposer interconnects electrically coupled to the at least one memory interconnect and electrically connected to the second subset of interposer interconnects by interposer conductive traces arranged at least partially parallel to the interposer substrate such that no electrical connection exists between the interposer conductive traces and the conductive circuit paths of the circuit substrate.
2. The computing device of claim 1 , wherein the at least one memory device comprises at least one set of stacked memory chips.
3. The computing device of claim 1 , wherein the fourth subset of interposer interconnects are on the first side of the interposer substrate.
4. The computing device of claim 1 , wherein the processor and the at least one memory device are arranged to both be in direct contact with a single heat sink.
5. The computing device of claim 1 , wherein interposer substrate is soldered to the processor, the circuit substrate, and the at least one memory device.
6. The computing device of claim 1 , wherein processor is a graphics processing unit.