Systems and methods for cooling a superconducting switch using dual cooling paths

1. A system, comprising:

a vacuum chamber;

a switch consisting of a winding unit, the winding unit consisting of a wire wound around a bobbin, the winding unit disposed in the vacuum chamber and configured to switch from a resistive state in a first mode to a superconducting state in a second mode when a temperature associated with the winding unit is below a threshold temperature;

a first cooling path comprising a solid thermal component in direct contact with the winding unit and a second cooling path comprising a cooling tube with a coolant circulating therethrough disposed in direct contact with the winding unit, the first cooling path and the second cooling path defining dual cooling paths to cool the temperature of the winding unit below the threshold temperature to transition the winding unit from the first mode to the second mode; and

wherein the first cooling path and the second cooling path are configured to operate simultaneously to jointly cool the temperature of the winding unit.

2. The system as claimed in claim 1 , further comprising a flow control component disposed to control a flow of the coolant in the cooling tube.

3. The system as claimed in claim 2 , wherein the flow control component is a cryogenic valve.

4. The system as claimed in claim 3 , wherein the cryogenic valve is a latching valve.

5. The system as claimed in claim 2 , wherein the flow control component is an orifice flow restrictor.

6. The system as claimed in claim 1 , further comprising at least one of a buffer mass and an evaporated gas buffer tank disposed to absorb heat in the coolant.

7. The system as claimed in claim 1 , wherein the cooling tube circulates the coolant in the cooling tube to absorb heat generated by the winding unit.

8. The system as claimed in claim 1 , wherein the solid thermal component comprises one of a thermally conductive metal rod, a thermally conductive metal sheet and thermally conductive metal bar, in direct contact with each of the winding unit and the cooling tube.

9. The system as claimed in claim 1 , further comprising an additional cooling tube disposed in direct contact with the solid thermal component and configured to circulate a coolant therein.

10. The system as claimed in claim 1 , wherein the cooling tube comprises:

an inlet coupled to a coolant reservoir and configured to receive the coolant from the coolant reservoir; and

an outlet coupled to the coolant reservoir and configured to convey evaporated coolant from the cooling tube to the coolant reservoir.

11. The system as claimed in claim 10 , wherein the inlet is configured to receive the coolant from the coolant reservoir when the winding unit is above the threshold temperature and wherein the outlet is configured to convey the evaporated coolant to the coolant reservoir.

12. The system as claimed in claim 1 , wherein the coolant comprises at least one of liquid helium (LHe), liquid hydrogen (LH 2 ), liquid neon (LNe), and liquid nitrogen (LN 2 ).

13. A system, comprising:

the system with a cooled persistent current switch in accordance with claim 1 ; and

a superconducting magnet coupled to the persistent current switch, wherein the superconducting magnet is configured to generate a magnetic field based on the switching of the persistent current switch between the first mode and the second mode.

14. The system as claimed in claim 13 , further comprising a flow control component disposed to control a flow of the coolant in the cooling tube.

15. The switching system as claimed in claim 13 , wherein the solid thermal component and the winding unit are each in thermal communication with the coolant tube to absorb heat generated by the winding unit.