Laser device
The present disclosure provides a laser device, where the laser device comprises a substrate, a seed laser disposed on the substrate, and a radiofrequency coil. Two connection ends of the radiofrequency coil are connected with corresponding pin ends of the seed laser, respectively.
1. A laser device, comprising:
a substrate;
a seed laser disposed on the substrate; and
a radiofrequency coil;
wherein two connection ends of the radiofrequency coil are connected with corresponding pin ends of the seed laser, respectively;
wherein characteristic impedance of the radio frequency coil matches with characteristic impedance of the seed laser;
wherein the substrate is a printed circuit board (PCB) and the radiofrequency coil is disposed on a first end surface of the PCB, and the two pin ends of the seed laser are disposed on a second end surface of the PCB;
wherein a through-hole of the PCB is located in an interval of a wire wrapping of the radiofrequency coil; a plurality of connection pins are disposed on the first and/or second end surface of the PCB; two connection pins of the first and/or second end surface of the PCB are connected with the pin ends of the seed laser, respectively; two connection pins of the first and/or second end surface of the PCB are connected with two connection ends of the radiofrequency coil.
2. The laser device according to claim 1 , wherein the laser device further comprises a semiconductor cooler disposed on the substrate.
3. The laser device according to claim 1 , wherein the laser device further comprises a temperature sensor disposed on the substrate.
4. The laser device according to claim 1 , wherein the PCB is a flexible PCB.
5. The laser device according to claim 1 , wherein the PCB is a flexible PCB.
6. The laser device according to claim 2 , wherein the PCB is a flexible PCB.
7. The laser device according to claim 3 , wherein the PCB is a flexible PCB.
8. The laser device according to claim 1 , wherein the laser device further comprises a RC buffer circuit connected in parallel with the laser.
9. The laser device according to claim 1 , wherein the laser device further comprises a housing; the substrate is disposed in the housing, and the housing is connected with the connection pins of the substrate.
10. The laser device according to claim 1 , wherein the radiofrequency coil is one of a square coil, a quasi-square coil, a circular coil, and a quasi-circular coil.