Electromagnetic interference shields for electronic packages and related methods
View Patent ↗Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.
1. An electronic device package, comprising:
a substrate comprising:
electronic circuitry in or on at least a first side of the substrate; and
at least one conductive terminal at a lateral edge of the substrate;
an insulating material formed over the first side of the substrate and the electronic circuitry, the insulating material having a top surface; and
an electromagnetic interference (EMI) shield comprising:
a solid conductor adhered to the top surface of the insulating material opposite the first side of the substrate, the insulating material electrically insulating the electronic circuitry from the solid conductor; and
a conductive material at least partially surrounding the lateral edge of the substrate and electrically connecting the conductive terminal to the solid conductor, the conductive material having a top surface co-planar with the top surface of the insulating material.
2. The electronic device package of claim 1 , wherein the conductive material includes a cured conductive paste.
3. The electronic device package of claim 2 , wherein the cured conductive paste includes a cured epoxy including conductive particles.
4. The electronic device package of claim 1 , wherein the at least one conductive terminal extends completely around the lateral edge of the substrate.
5. The electronic device package of claim 1 , wherein the at least one conductive terminal is electrically connected to ground.
6. The electronic device package of claim 1 , wherein the solid conductor comprises a metal foil.
7. The electronic device package of claim 6 , wherein the metal foil comprises at least one metal selected from the group consisting of a copper foil, an aluminum foil, a silver foil, and a gold foil.
8. The electronic device package of claim 1 , wherein the insulating material includes an over mold including one of plastic or rubber.
9. The electronic device package of claim 1 , wherein the insulating material includes an insulating epoxy.
10. The electronic device package of claim 1 , wherein the insulating material includes silicon dioxide.
11. The electronic device package of claim 1 , wherein the conductive material completely surrounds the lateral edge of the substrate.
12. An electronic device package, comprising:
a substrate including electronic circuitry on or in a first side of the substrate;
a solid conductor configured to shield the first side of the substrate from electromagnetic interference (EMI);
an insulating material between the substrate and the solid conductor, the insulating material having a top surface, and the solid conductor adhered to the top surface of the insulating material; and
a conductive material at least partially surrounding a lateral edge of the substrate, the conductive material having a top surface co-planar with the top surface of the insulating material.
13. The electronic device package of claim 12 , wherein the conductive material is in contact with the solid conductor.
14. The electronic device package of claim 12 , further comprising a conductive terminal at the lateral edge of the substrate and electrically connected to the conductive material.
15. The electronic device package of claim 14 , wherein the conductive terminal is configured to connect the conductive material to a ground terminal of the substrate.
16. The electronic device package of claim 14 , wherein the conductive terminal is configured to electrically connect the solid conductor to a ground terminal of the substrate through the conductive material.
17. The electronic device package of claim 12 , further comprising one or more conductive pads on or in a second side of the substrate, the second side of the substrate opposite the first side.
18. The electronic device package of claim 17 , wherein the one or more conductive pads include one of pads, pins, or solder balls.