STANDARDIZED HOT-PLUGGABLE TRANSCEIVING UNIT WITH HEAT DISSIPATION CAPABILITIES
Transceiving unit with heat dissipation capabilities. The transceiving unit comprises a housing adapted to being inserted into a port of a hosting unit, the housing defining a top surface. The transceiving unit comprises a rear connector located on a back panel of the housing. The transceiving unit comprises at least one electronic component located inside the housing. The transceiving unit comprises an insert disposed along the top surface of the housing, the insert passively extracting heat generated by the at least one electronic component located inside the housing. Alternatively or complementarily to the insert, the transceiving unit comprises a heat sink integrated to a front panel of the housing for passively extracting heat generated by the at least one electronic component located inside the housing. In a particular aspect, the transceiving unit is a standardized hot-pluggable transceiving unit, the housing having standardized dimensions.
1 . A transceiving unit comprising:
a housing adapted to being inserted into a chassis of a hosting unit, the housing defining a top surface;
at least one electronic component located inside the housing;
an insert disposed along the top surface of the housing, the insert passively extracting heat generated by the at least one electronic component located inside the housing; and
a rear connector located on a back panel of the housing.
2 . The transceiving unit of claim 1 , wherein the insert is made of copper, silver, graphite, gold, platinum, or an alloy of a combination thereof.
3 . The transceiving unit of claim 1 , wherein the insert is integral to the top surface of the housing.
4 . The transceiving unit of claim 3 , wherein the top surface of the housing is entirely made of the insert.
5 . The transceiving unit of claim 1 , wherein the insert is affixed above the top surface of the housing.
6 . The transceiving unit of claim 1 , wherein the transceiving unit is a standardized hot-pluggable transceiving unit and the housing has standardized dimensions.
7 . The transceiving unit of claim 6 , wherein the transceiving unit is a Small Form-factor Pluggable (SFP) unit.
8 . The transceiving unit of claim 1 , further comprising at least one front connector located on a front panel of the housing.
9 . The transceiving unit of claim 1 , comprising no front connector located on a front panel of the housing.
10 . A transceiving unit comprising:
a housing adapted to being inserted into a chassis of a hosting unit, the housing comprising a front panel;
at least one electronic component located inside the housing;
a heat sink integrated to the front panel for passively extracting heat generated by the at least one electronic component located inside the housing; and
a rear connector located on a back panel of the housing.
11 . The transceiving unit of claim 10 , wherein the heat sink is at least partially located inside the front panel of the housing.
12 . The transceiving unit of claim 10 , wherein the heat sink is affixed to a surface of the front panel external to the housing.
13 . The transceiving unit of claim 10 , wherein the transceiving unit is a standardized hot-pluggable transceiving unit and the housing has standardized dimensions.
14 . The transceiving unit of claim 13 , wherein the transceiving unit is a Small Form-factor Pluggable (SFP) unit.
15 . The transceiving unit of claim 10 , comprising no front connector located on the front panel of the housing.
16 . The transceiving unit of claim 10 , further comprising at least one front connector located on the front panel of the housing.
17 . The transceiving unit of claim 10 , further comprising an active cooling device located inside the housing.
18 . The transceiving unit of claim 17 , wherein the active cooling device consists of a fan, a blower, a thermoelectric cooler or a heat pipe.
19 . The transceiving unit of claim 17 , wherein the active cooling device is located in the vicinity of a surface of the front panel internal to the housing.
20 . The transceiving unit of claim 10 , further comprising an insert disposed along a top surface of the housing, the insert passively extracting heat generated by the at least one electronic component located inside the housing.