Methods and assemblies for gas flow ratio control
Methods and gas flow control assemblies configured to deliver gas to process chamber zones in desired flow ratios. In some embodiments, assemblies include one or more MFCs and a back pressure controller (BPC). Assemblies includes a controller, a process gas supply, a distribution manifold, a pressure sensor coupled to the distribution manifold and configured to sense back pressure of the distribution manifold, a process chamber, a one or more mass flow controllers connected between the distribution manifold and process chamber to control gas flow there between, and a back pressure controller provided in fluid parallel relationship to the one or more mass flow controllers, wherein precise flow ratio control is achieved. Alternate embodiments include an upstream pressure controller configured to control flow of carrier gas to control back pressure. Further methods and assemblies for controlling zonal gas flow ratios are described, as are other aspects.
1. A method of controlling flow of a gas to a process chamber comprising a plurality of zones, the method comprising:
providing a mass flow controller fluidly coupled to a first plurality of channels distributed within a first zone subset of the plurality of zones of the process chamber;
providing a distribution manifold fluidly coupled to the mass flow controller;
providing a back pressure controller fluidly coupled to the distribution manifold and to a second plurality of channels distributed within a second zone subset of the plurality of zones of the process chamber, wherein the second zone subset does not include any zone of the first zone subset;
controlling a first gas flow through the mass flow controller into the first zone subset of the plurality of zones via the first plurality of channels, the first gas flow controlled to a dynamically-controllable flow set point;
controlling back pressure upstream of the back pressure controller to a back pressure set point; and
controlling a second gas flow through the back pressure controller into the second zone subset of the plurality of zones via the second plurality of channels.
2. The method of claim 1 , wherein the process chamber is a semiconductor process chamber.
3. The method of claim 1 , wherein the dynamically-controllable flow set point for the mass flow controller is set to a nominal flow rate +/−1%.
4. The method of claim 1 , further comprising a plurality of mass flow controllers and one, and only one, back, pressure controller.
5. The method, of claim 1 , wherein the back pressure controller controls the back pressure in the distribution manifold.
6. The method of claim 1 , wherein the back pressure controller is fluidly coupled to the processing chamber.
7. The method of claim 1 , wherein the back pressure controller is fluidly coupled to a vent or scrubber.
8. The method of claim 1 , wherein the back pressure controller controls the back pressure to a predetermined back pressure set point.
9. The method of claim 1 , wherein a plurality of mass flow controllers supply the gas to at least two of the plurality of zones of the process chamber.
10. The method of claim 1 , wherein flow to the back pressure controller is exhausted to one of:
a vent; or
a scrubber.
11. The method of claim 1 , wherein a back pressure set point of the back pressure controller is set to be between 50 Torr and 1600 Torr.
12. A method of controlling flow of a gas to a process chamber comprising a plurality of zones, the method comprising:
controlling gas flow through each of a plurality of mass flow controllers fluidly coupled between the process chamber and a distribution manifold, wherein a first mass flow controller of the plurality of mass flow controllers is configured to control a first gas flow into a first zone subset of the plurality of zones, the first gas flow controlled to a first dynamically-controllable flow set point, and a second mass flow controller of the plurality of mass flow controllers is configured to control a second gas flow into a second zone subset of the plurality of zones, the second gas flow controlled to a second dynamically-controllable flow set point;
controlling back pressure upstream of a back pressure controller fluidly coupled to the distribution manifold to a back pressure set point; and
controlling a third gas flow through the back pressure controller into a third zone subset of the plurality of zones of the process chamber, the third zone subset not including any zone of the first zone subset or the second zone subset.
13. The method of claim 12 , wherein the process chamber is a semiconductor process chamber.
14. The method of claim 12 , wherein the first dynamically-controllable flow set point and the second dynamically-controllable flow set point are set to a nominal flow rate +/−1%.
15. The method of claim 12 , wherein the back pressure controller controls the back pressure in the distribution manifold.
16. The method of claim 12 , wherein the back pressure controller controls the back pressure to a predetermined back pressure set point.
17. A method of controlling flow of a gas to a process chamber comprising a plurality of zones, the method comprising:
controlling flow through each of a plurality of mass flow controllers fluidly coupled between a distribution manifold and the process chamber, wherein a first mass flow controller of the plurality of mass flow controllers is configured to control a first gas flow into a first zone subset of the plurality of zones, the first gas flow controlled to a first dynamically-controllable flow set point, and a second mass flow controller of the plurality of mass flow controllers is configured to control a second gas flow into a second zone subset of the plurality of zones, the second gas flow controlled to a second dynamically-controllable flow set point; and
controlling back pressure upstream of a back pressure controller to a back pressure set point, the back pressure controller fluidly coupled to at least one of a vent or a scrubber fluidly coupled to the process chamber.
18. The method of claim 17 , further comprising:
exhausting flow provided to the back pressure controller to at least one of the vent or the scrubber.
19. The method of claim 17 , wherein the process chamber is a semiconductor process chamber.
20. The method of claim 17 , wherein the first dynamically-controllable flow set point and the second dynamically-controllable flow set point are set to a nominal flow rate +/−1%.