Multi-state transistor devices with multiple threshold voltage channels
A method of forming a multi-state nanosheet transistor device is provided. The method includes forming an alternating sequence of sacrificial layer segments and differentially doped nanosheet layer segments on a substrate, wherein each of the differentially doped nanosheet layer segments has a different dopant concentration from the other differentially doped nanosheet layer segments. The method further includes forming a source/drain on each of opposite ends of the sacrificial layer segments and differentially doped nanosheet layer segments, and removing the sacrificial layer segments. The method further includes depositing a gate dielectric layer on the differentially doped nanosheet layer segments, and forming a gate electrode on the gate dielectric layer to form a common gate-all-around structure, where each of the differentially doped nanosheet layer segments conducts current at a different threshold voltage.
1. A method of forming a multi-state nanosheet transistor device, comprising:
forming an alternating sequence of sacrificial layer segments and differentially doped nanosheet layer segments on a substrate, wherein each of the differentially doped nanosheet layer segments has a different dopant concentration from the other differentially doped nanosheet layer segments;
forming a source/drain on each of opposite ends of the sacrificial layer segments and differentially doped nanosheet layer segments;
removing the sacrificial layer segments;
depositing a gate dielectric layer on the differentially doped nanosheet layer segments; and
forming a gate electrode on the gate dielectric layer to form a common gate-all-around structure, where each of the differentially doped nanosheet layer segments conducts current at a different threshold voltage.
2. The method of claim 1 , wherein the differentially doped nanosheet layer segments each have a dopant concentration in a range of about 1×10 11 cm −3 to about 1×10 19 cm −3 .
3. The method of claim 1 , wherein the alternating sequence of sacrificial layer segments and differentially doped nanosheet layer segments includes at least four differentially doped nanosheet layer segments, which includes a second differentially doped nanosheet layer segment that has about double the dopant concentration of a first differentially doped nanosheet layer segment of the at least four differentially doped nanosheet layer segments.
4. The method of claim 3 , wherein the first differentially doped nanosheet layer segment has a dopant concentration of about 1×10 12 cm′ to about 1×10 18 cm −3 , and the second differentially doped nanosheet layer segment has a dopant concentration of about 2×10 12 cm 3 to about 2×10 18 cm −3 .
5. The method of claim 4 , wherein a third differentially doped nanosheet layer segment of the at least four differentially doped nanosheet layer segments has a dopant concentration of about 4×10 12 cm −3 to about 4×10 18 cm −3 .
6. The method of claim 5 , wherein a fourth differentially doped nanosheet layer segment of the at least four differentially doped nanosheet layer segments has a dopant concentration of about 8×10 12 cm −3 to about 8×10 18 cm −3 .
7. The method of claim 6 , wherein the dopant concentrations of the at least four differentially doped nanosheet layer segments provide an integer multiple of about a 150 mV difference in the threshold voltages between each vertically adjacent pair of the at least four differentially doped nanosheet layer segments.