Pressure sensing implant
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
1. A method of making a circuit comprising:
providing a housing that defines a cavity and an opening;
positioning at least one electrode on a lid wafer, wherein said lid wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said second surface;
positioning at least one electrode on a base wafer, wherein said base wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said first surface;
bonding a portion of said first surface of said base wafer to said second surface of said lid wafer to form said sensor; and
inserting at least one electronic assembly within said cavity of said housing;
bonding said sensor to said opening of said housing wherein said base wafer is positioned entirely within said cavity defined by said housing wherein the step of bonding said sensor to said opening of said housing is performed prior to inserting at least one electronic assembly within said cavity of said housing.
2. The method of claim 1 , wherein said at least one electrode on said second surface of said lid wafer includes slots or otherwise breaks that result in a non-continuous solid area for preventing the formation of eddy currents during use of the sensor.
3. The method of claim 1 further comprising attaching side walls to said housing to form a hermetic seal in said housing.
4. The method of claim 1 , wherein said electronic assembly are inserted into said housing through an open face or slot wherein said open face or slot is positioned along a side of the housing.
5. The method of claim 1 , wherein said housing includes a ledge around a periphery of said opening.
6. The method of claim 1 further comprising tuning said circuit of the at least one electronic assembly within said cavity of said housing after bonding said sensor to said opening of said housing.
7. The method of claim 1 , wherein the step of bonding said sensor to said opening of said housing is performed by a frit process or a direct glass welding process.
8. A method of making a circuit comprising:
providing a housing that defines a cavity and an opening;
positioning at least one electrode on a lid wafer, wherein said lid wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said second surface;
positioning at least one electrode on a base wafer, wherein said base wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said first surface;
bonding a portion of said first surface of said base wafer to said second surface of said lid wafer to form said sensor;
inserting at least one electronic assembly within said cavity of said housing;
bonding said sensor to said opening of said housing wherein said base wafer is positioned entirely within said cavity defined by said housing; and
tuning said circuit of the at least one electronic assembly within said cavity of said housing after bonding said sensor to said opening of said housing.
9. A method of making a circuit comprising:
providing a housing that defines a cavity and an opening;
positioning at least one capacitive plate on a lid wafer, wherein said lid wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said second surface;
positioning at least one capacitive plate on a base wafer, wherein said base wafer includes a first surface and an opposite second surface wherein said at least one capacitive plate is positioned on said first surface;
bonding a portion of said first surface of said base wafer to said second surface of said lid wafer to form said sensor;
inserting at least one electronic assembly within said cavity of said housing; and
bonding said sensor to said opening of said housing wherein said base wafer is positioned entirely within said cavity defined by said housing.
10. The method of claim 9 , wherein the step of bonding said sensor to said opening of said housing is performed prior to inserting at least one electronic assembly within said cavity of said housing.
11. The method of claim 9 , wherein said at least one capacitive plate on said second surface of said lid wafer includes slots or otherwise breaks that result in a non-continuous solid area for preventing the formation of eddy currents during use of the sensor.
12. The method of claim 9 further comprising attaching side walls to said housing to form a hermetic seal in said housing.
13. The method of claim 9 , wherein said electronic assembly is inserted into said housing through an open face or slot wherein said open face or slot is positioned along a side of the housing.
14. The method of claim 9 , wherein said housing includes a ledge around a periphery of said opening.
15. The method of claim 9 further comprising tuning said circuit of the at least one electronic assembly within said cavity of said housing after bonding said sensor to said opening of said housing.
16. The method of claim 9 , wherein the step of bonding said sensor to said opening of said housing is performed by a frit process or a direct glass welding process.