Artificial nail tip and curing composition set and applying method thereof
A nail tip curing composition includes an Extend Gel, an edge-off flat brush, a nail filing device, a plurality of GEL-X tips, a pH Bonder, and a Non-Acidic Gel Primer. The pH Bonder forms a pH Bonder layer on a surface of a fingernail. The Non-Acidic Gel Primer forms a Non-Acidic Gel Prime layer overlapped on the pH Bonder layer. The Extend Gel forms an Extend Gel layer overlapped on the Non-Acidic Gel Prime layer. The GEL-X tip is filed by the nail filing device and the Extend Gel is applied on an underside contact surface of the Gel-X tip by the edge-off flat brush. The underside contact surface of the Gel-X tip is contacted with the Extend Gel layer on the fingernail in such a manner that the Gel-X tip is firmly affixed on the fingernail.
1. An artificial nail and curing composition set for a fingernail, comprising:
at least one artificial nail tip, the artificial nail tip being made of acrylic material and having an underside surface which can be filed into a plurality of indented grooves;
a nail filing device configured for filing the underside surface of an artificial nail tip to form a plurality of indented grooves;
an adhesive composition consisting of:
(a) 60.0-80.0% by weight of polyurethane acrylate oligomers;
(b) 10.0-15.0% by weight of 2-hydroxyethyl methacrylate;
(c) 1.0-5.0% by weight of 1-hydroxycyclohexyl phenyl ketone;
(d) 1.0-5.0% by weight of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide; and
a flat brush for applying the adhesive composition to the plurality of indented grooves on the underside of an artificial nail tip and to a surface of a fingernail;
wherein curing the adhesive composition with UV light for about 2 minutes forms a bonding layer between the indented grooves on the underside of the artificial nail tip and the surface of the fingernail; and
wherein the bonding layer affixes the artificial nail tip to the surface of the fingernail for at least two weeks.
2. The artificial nail and curing composition set of claim 1 further comprising a LED lamp.
3. The artificial nail and curing composition set of claim 1 wherein the adhesive composition has a specific gravity of 1.06-1.08.
4. The artificial nail and curing composition set of claim 2 wherein the adhesive composition has a specific gravity of 1.06-1.08.
5. The artificial nail and curing composition set of claim 1 further comprising a top coat composition for application to the artificial nail tip, the top coat composition consisting essentially of:
(a) 35.0-50.0% by weight of polyurethane acrylate oligomers;
(b) 15.0-30.0% by weight of 2-hydroxyethyl methacrylate;
(c) 10.0-25.0% by weight of di(trimethylolpropane) tetraacrylate;
(d) 5.0-10.0% by weight of pentaerythritol tetra(3-mercaptopropionate); and
(e) 0.0-1.0% by weight of polyether-modified polysiloxane.
6. The artificial nail and curing composition set of claim 2 further comprising a top coat composition for application to the artificial nail tip, the top coat composition consisting essentially of:
(a) 35.0-50.0% by weight of polyurethane acrylate oligomers;
(b) 15.0-30.0% by weight of 2-hydroxyethyl methacrylate;
(c) 10.0-25.0% by weight of di(trimethylolpropane) tetraacrylate;
(d) 5.0-10.0% by weight of pentaerythritol tetra(3-mercaptopropionate); and
(e) 0.0-1.0% by weight of polyether-modified polysiloxane.
7. The artificial nail and curing composition set of claim 3 further comprising a top coat composition for application to the artificial nail tip, the top coat composition consisting essentially of:
(a) 35.0-50.0% by weight of polyurethane acrylate oligomers;
(b) 15.0-30.0% by weight of 2-hydroxyethyl methacrylate;
(c) 10.0-25.0% by weight of di(trimethylolpropane) tetraacrylate;
(d) 5.0-10.0% by weight of pentaerythritol tetra(3-mercaptopropionate); and
(e) 0.0-1.0% by weight of polyether-modified polysiloxane;
wherein said top coat composition has a boiling point of 212° F., a flash point of 96° F., and a specific gravity of 1.14.
8. The artificial nail and curing composition set of claim 4 further comprising a top coat composition for application to the artificial nail tip, the top coat composition consisting essentially of:
(a) 35.0-50.0% by weight of polyurethane acrylate oligomers;
(b) 15.0-30.0% by weight of 2-hydroxyethyl methacrylate;
(c) 10.0-25.0% by weight of di(trimethylolpropane) tetraacrylate;
(d) 5.0-10.0% by weight of pentaerythritol tetra(3-mercaptopropionate); and
(e) 0.0-1.0% by weight of polyether-modified polysiloxane;
wherein said top coat composition has a boiling point of 212° F., a flash point of 96° F., and a specific gravity of 1.14.
9. The artificial nail and curing composition set of claim 7 further comprising a pH bonder and a non-acidic gel primer, wherein the pH bonder is applied to the surface of the fingernail to form a pH bonder layer, the non-acidic gel primer is applied to the pH bonder layer to form a primer layer, and the adhesive composition is applied to the primer layer.
10. The artificial nail and curing composition set of claim 8 further comprising a pH bonder and a non-acidic gel primer, wherein the pH bonder is applied to the surface of the fingernail to form a pH bonder layer, the non-acidic gel primer is applied to the pH bonder layer to form a primer layer, and the adhesive composition is applied to the primer layer.