Substrate processing method, substrate processing apparatus, and composite processing apparatus
According to one embodiment, a first liquid is supplied on a first face of a substrate. The first liquid has a pH with which a surface zeta potential of the substrate becomes negative and a surface zeta potential of a foreign substance attaching to the first face becomes positive. Then, a solidified layer in which at least part of the first liquid has been solidified is formed by cooling the substrate down to be equal to or lower than a solidification point of the first liquid. Thereafter, the solidified layer is melted.
1. A substrate processing apparatus comprising:
a substrate holder configured to hold a substrate in a state where a first face of the substrate is on an upper side;
a processing liquid supply section including a plurality of processing liquid storage parts that store processing liquids different in pH, and configured to supply at least one of the processing liquids onto the first face;
a cooling medium supply section including a cooling medium storage part that is capable of storing a cooling medium, the cooling medium supply section being configured to solidify a processing liquid supplied on the first face;
a gas bubble injection part configured to inject gas bubbles into the processing liquid supplied on the first face; and
a controller configured to:
select a processing liquid having a pH with which a surface zeta potential of the substrate becomes negative and a surface zeta potential of a foreign substance attaching to the first face becomes positive, and
cause:
the processing liquid supply section to supply the selected processing liquid onto the first face,
the gas bubble injection part to inject gas bubbles into the processing liquid supplied on the first face, and
the cooling medium supply section to supply the cooling medium to solidify the processing liquid having the gas bubbles injected therein on the first face.
2. The substrate processing apparatus according to claim 1 , wherein the gas bubble injection part is an ultrasonic wave applying device that applies ultrasonic waves to the processing liquid on the substrate.
3. The substrate processing apparatus according to claim 1 ,
wherein the gas bubble injection part is an electrolysis device that performs electrolysis to the processing liquid by immersing metal electrodes into the processing liquid on the substrate.
4. The substrate processing apparatus according to claim 1 , wherein the substrate is a quartz substrate.
5. The substrate processing apparatus according to claim 1 , wherein the first face is a patterned face including a protruding portion.