Thermosetting resin composition for LDS, resin molded article, and three-dimensional molded interconnect device
The thermosetting resin composition for LDS of the invention includes a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays, and a coupling agent, in which the non-conductive metal compound includes one or more selected from the group consisting of a spinel-type metal oxide, a metal oxide having two or more transition metal elements in groups adjacent to each other, the groups being selected from groups 3 to 12 of the periodic table, and a tin-containing oxide, and the coupling agent includes one or more selected from the group consisting of mercaptosilane, aminosilane, and epoxysilane.
1. A thermosetting resin composition for laser direct structuring (LDS), used for LDS, comprising:
a thermosetting resin;
an inorganic filler;
a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays; and
a coupling agent,
wherein said thermosetting resin composition does not include a thermoplastic resin,
wherein the non-conductive metal compound includes one or more selected from the group consisting of
a spinel metal oxide,
a metal oxide having two or more transition metal elements in groups adjacent to each other, the groups being selected from groups 3 to 12 of the periodic table, and
a tin-containing oxide, and
wherein the inorganic filler, which is different from the non-conductive metal compound, includes one or two or more selected from the group consisting of silica, alumina, aluminum hydroxide, silicon nitride, and aluminum nitride,
wherein the coupling agent includes one or more selected from the group consisting of mercaptosilane, aminosilane, and epoxysilane,
wherein the thermosetting resin composition is a melt-kneaded product, and
wherein the thermosetting resin composition is in a stage B state, and is powdery, granular, or in the shape of a tablet.
2. The thermosetting resin composition for LDS according to claim 1 ,
wherein an average particle diameter D50 of the inorganic filler is equal to or less than 30 μm.
3. The thermosetting resin composition for LDS according to claim 1 ,
wherein a D90 of the inorganic filler is equal to or less than 80 μm.
4. The thermosetting resin composition for LDS according to claim 1 ,
wherein a particle size distribution width (D90/D50) of the inorganic filler is equal to or less than 10.
5. The thermosetting resin composition for LDS according to claim 1 ,
wherein a content of the non-conductive metal compound is equal to or more than 5% by mass and equal to or less than 18% by mass with respect to the total amount of the thermosetting resin composition for LDS.
6. The thermosetting resin composition for LDS according to claim 1 ,
wherein a spiral flow length of the thermosetting resin composition for LDS, as measured under the conditions of a mold temperature of 175° C., an injection pressure of 6.9 MPa, and a dwelling time of 120 seconds in accordance with an EMMI-1-66 method, is equal to or more than 50 cm.
7. The thermosetting resin composition for LDS according to claim 1 ,
wherein carbon is not included.
8. The thermosetting resin composition for LDS according to claim 1 ,
wherein the non-conductive metal compound contains the spinel metal oxide containing copper or chromium.
9. The thermosetting resin composition for LDS according to claim 1 ,
wherein the inorganic filler includes silica.
10. The thermosetting resin composition for LDS according to claim 1 ,
wherein the thermosetting resin includes an epoxy resin.
11. The thermosetting resin composition for LDS according to claim 10 ,
wherein the epoxy resin includes one or more selected from the group consisting of an orthocresol novolac epoxy resin, a phenolaralkyl epoxy resin having a biphenylene skeleton, and a triphenylmethane epoxy resin.
12. The thermosetting resin composition for LDS according to claim 1 , further comprising a curing agent.
13. The thermosetting resin composition for LDS according to claim 1 , further comprising a curing accelerator.
14. The thermosetting resin composition for LDS according to claim 1 ,
wherein the content of the thermosetting resin is equal to or more than 1% by mass and equal to or less than 15% by mass with respect to the total amount of the thermosetting resin composition.
15. The thermosetting resin composition for LDS according to claim 1 ,
wherein the content of the coupling agent is equal to or more than 0.01% by mass and equal to or less than 1% by mass with respect to the total amount of the thermosetting resin composition.
16. The thermosetting resin composition for LDS according to claim 1 ,
where in the silica selected from the group consisting of molten crushed silica, molten spherical silica, and crystalline silica.
17. The thermosetting resin composition for LDS according to claim 1 , further comprising one or two or more selected from a release agent, a flame retardant, an ion trapping agent, a coloring agent, a low-stress agent, and an antioxidant.
18. The thermosetting resin composition for LDS according to claim 17 ,
wherein the release agent includes one or two or more selected from natural wax, carnauba wax, synthetic wax, montanic acid ester wax, polyethylene oxide wax, a higher fatty acid or a metal salt thereof, zinc stearate, and paraffin,
wherein the flame retardant includes one or two or more selected from aluminum hydroxide, magnesium hydroxide, zinc borate, zinc molybdate, and a phosphazene,
wherein the ion trapping agent includes one or two or more selected from hydrotalcites or hydrated oxides of elements selected from magnesium, aluminum, bismuth, titanium, and zirconium,
wherein the coloring agent includes one or two or more selected from carbon black, red iron oxide, and titanium oxide, and
wherein the low-stress agent includes one or two or more selected from a silicone compound, an acrylonitrilebutadiene copolymerized compound, silicone oil, and silicone rubber.