IP Library Granted Patent US 10,975,265
Granted Patent B2
US 10,975,265 · App. 16/304,350 · Granted Apr 13, 2021

Radical-curable adhesive composition and adhesive

Inventors: Ryohei Ito (Tokyo, JP); Tsunehiko Nishimura (Tokyo, JP); Akifumi Tamura (Tokyo, JP); Nobuyuki Takahashi (Tokyo, JP)
Assignee: SHOWA DENKO K.K.
C09J4/06C09J11/04C09J11/06C09J109/02C09J121/00C09J133/10C08K3/013
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Quick Facts
Patent No.
US 10,975,265
App. No.
16/304,350
Granted
Apr 13, 2021
Kind
B2
Abstract

A radical-curable adhesive composition containing a rubber (a) having one or more (meth)acryloyl groups within a single molecular chain, a polymerizable monomer (b) having both an epoxy group and a (meth)acryloyloxy group in the molecule, and a radical polymerization initiator (c). The rubber (a) is preferably a polymer of a monomer containing at least acrylonitrile.

Claims (19)

1. A radical-curable adhesive composition comprising:

a rubber (a) having one or more (meth)acryloyl groups within a single molecular chain,

a polymerizable monomer (b) having both an epoxy group and a (meth)acryloyloxy group in each molecule,

a radical polymerization initiator (c),

a polymerizable monomer (d) other than the polymerizable monomer (b) and excluding (meth)acrylic acid, and

a vinyl ester compound (e),

wherein the vinyl ester compound (e) is one or more compounds selected from the group consisting of bisphenol vinyl ester resins and novolak vinyl ester resins.

2. The radical-curable adhesive composition according to claim 1 , wherein the rubber (a) is a polymer of a monomer comprising at least acrylonitrile.

3. The radical-curable adhesive composition according to claim 1 , wherein the main chain of the rubber (a) is a copolymer of acrylonitrile and butadiene.

4. The radical-curable adhesive composition according to claim 1 , wherein the polymerizable monomer (b) comprises glycidyl (meth)acrylate.

5. The radical-curable adhesive composition according to claim 1 , wherein a total amount of the polymerizable monomer (b) and the polymerizable monomer (d) other than the polymerizable monomer (b) and excluding (meth)acrylic acid is from 20 to 200 parts by mass per 100 parts by mass of the rubber (a).

6. The radical-curable adhesive composition according to claim 1 , wherein an amount of the polymerizable monomer (b) is from 10 to 100 parts by mass per 100 parts by mass of a total amount of the polymerizable monomer (b) and the polymerizable monomer (d) other than the polymerizable monomer (b) and excluding (meth)acrylic acid.

7. The radical-curable adhesive composition according to claim 1 , wherein a total amount of the rubber (a) and the vinyl ester compound (e) is from 105 to 200 parts by mass per 100 parts by mass of the rubber (a).

8. The radical-curable adhesive composition according to claim 1 , further comprising an inorganic filler (f).

9. The radical-curable adhesive composition according to claim 8 , comprising 3 to 1,000 parts by mass of the inorganic filler (f) per 100 parts by mass of a total amount of the rubber (a), the polymerizable monomer (b), the radical polymerization initiator (c), the polymerizable monomer (d) other than the polymerizable monomer (b) and excluding (meth)acrylic acid, and the vinyl ester compound (e).

10. The radical-curable adhesive composition according to claim 1 , wherein a cured product of the adhesive composition has insulating properties.

11. An adhesive comprising the radical-curable adhesive composition according to claim 1 .

12. An electrical or electronic component in which a component has been bonded and/or encapsulated using a cured product of the radical-curable adhesive composition according to claim 1 .

13. A transportation device in which a component has been bonded using a cured product of the radical-curable adhesive composition according to claim 1 .

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2018
From: ITO, RYOHEI; NISHIMURA, TSUNEHIKO; TAMURA, AKIFUMI; TAKAHASHI, NOBUYUKI
To: SHOWA DENKO K.K.
Reel/Frame 047580/0586 →