Device and method for reel-to-reel laser reflow
The present invention relates to a reel-to-reel layer reflow method, which emits a uniformized laser beam, which can easily adjust the emission area, and which is for the purpose of improving productivity. An embodiment of the present invention provides a reel-to-reel layer reflow method comprising the steps of: a) transferring a substrate, which has been wound in a roll type, to one side while unwinding the same; b) forming a solder portion on the substrate; c) seating an emission target element on the solder portion and seating a non-emission target element on the substrate; d) surface-emitting a laser beam to the solder portion, on which the emission target element is seated, such that the emission target element is attached to the substrate; e) inspecting the substrate structure manufactured through said step d); and f) winding the substrate structure in a roll type.
1. A reel-to-reel laser reflow method, the method comprising:
transferring a substrate, which has been wound in a roll type, to one side while unwinding the substrate;
forming a solder portion on the substrate;
seating an emission target element on the solder portion and seating a non-emission target element on the substrate;
pressing the substrate to contact a lower surface of the substrate with an upper surface of a conveyor for transferring the substrate;
surface-emitting a laser beam to the solder portion, on which the emission target element is seated, such that the emission target element is attached to the substrate;
inspecting the substrate structure having the attached emission target element; and
winding the substrate structure in a roll type,
wherein the surface-emitting of the laser beam comprises:
uniformizing the energy of the laser beam;
adjusting an emission area of the laser beam; and
reflowing the solder portion positioned within the emission area by the laser beam to thereby secure the emission target element to the substrate.
2. The method according to claim 1 , wherein the forming of the solder portion comprises forming a solder portion on the substrate by screen printing a solder paste on the substrate.
3. A reel-to-reel laser reflow method, the method comprising:
transferring a substrate, which has been wound in a roll type, to one side while unwinding the substrate;
forming a solder portion on the substrate;
seating an emission target element on the solder portion;
pressing the substrate to contact a lower surface of the substrate with an upper surface of a conveyor for transferring the substrate;
surface-emitting a laser beam to the solder portion, on which the emission target element is seated, such that the emission target element is attached to the substrate;
seating a non-emission target element on the substrate; and
winding the substrate structure in a roll type; and
wherein the surface-emitting of the laser beam comprises:
uniformizing the energy of the laser beam;
adjusting an emission area of the laser beam; and
reflowing the solder portion positioned within the emission area by the laser beam to thereby secure the emission target element to the substrate.