Adhesive film for semiconductor, and semiconductor device

1. An adhesive film for a semiconductor comprising:

a conductive layer containing at least one metal selected from the group consisting of copper, nickel, cobalt, iron, stainless steel (SUS), and aluminum, and having a thickness of 0.05 μm to 10 μm; and

an adhesive layer formed on at least one surface of the conductive layer and including a (meth)acrylate-based resin, a curing agent, and an epoxy resin;

wherein the adhesive film has a thickness of 0.1 μm to 300 μm,

wherein a thickness ratio of the conductive layer relative to the adhesive layer is 0.001 to 0.8,

wherein the (meth)acrylatebased resin includes a (meth)acrylate-based repeating unit containing an epoxy-based functional group, and has a hydroxyl equivalent weight of 0.15 eq/kg or less, and

wherein the curing agent includes a phenol resin.

2. The adhesive film for a semiconductor of claim 1 ,

wherein the conductive layer is a copper layer of 0.1 μm to 10 μm, a stainless steel (SUS) layer of 0.1 μm to 10 μm, an aluminum layer of 0.1 μm to 10 μm, a nickel layer of 0.1 μm to 10 μm, a cobalt layer of 0.1 μm to 10 μm, or an iron (Fe) layer of 0.1 μm to 10 μm.

3. The adhesive film for a semiconductor of claim 1 ,

further comprising a barrier layer formed between the conductive layer and the adhesive layer and having a thickness of 0.001 μm to 1 μm.

4. The adhesive film for a semiconductor of claim 3 ,

wherein the barrier layer includes at least one selected from the group consisting of titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), stainless steel, a nickel alloy, and a rare earth metal, or oxides thereof, and nitrides thereof.

5. The adhesive film for a semiconductor of claim 1 ,

wherein the (meth)acrylate-based resin further includes 2 to 40% by weight of the (meth)acrylate-based functional group containing an aromatic functional group.

6. The adhesive film for a semiconductor of claim 1 ,

wherein a weight ratio of the (meth)acrylate-based resin relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin is 0.55 to 0.95.

7. The adhesive film for a semiconductor of claim 1 ,

wherein the phenol resin has a softening point of 100° C. or more.

8. The adhesive film for a semiconductor of claim 1 ,

wherein the epoxy resin has a softening point of 50° C. to 120° C.

9. A semiconductor device comprising the adhesive film for a semiconductor of claim 1 , and a semiconductor element that is in contact with a surface of an adhesive layer of the adhesive film.

10. The semiconductor device of claim 9 ,

wherein the semiconductor device further includes an adherent for bonding with the semiconductor element through a wire bonding or flip-chip method.

11. The semiconductor device of claim 10 ,

wherein the adhesive film for a semiconductor is formed between the adherend and the semiconductor element, or

the adhesive film for a semiconductor is formed on a surface opposite to a surface to which the semiconductor element and the adherend are bonded.

12. The semiconductor device of claim 9 ,

wherein the semiconductor device includes two or more semiconductor elements, and at least two of the semiconductor elements are bonded via the adhesive film for a semiconductor.

13. The adhesive film for a semiconductor of claim 4 ,

wherein the nickel alloy includes an alloy containing nickel and one or more elements selected from the group consisting of carbon, manganese, silicon, sulfur, iron, copper, chromium, aluminum, titanium, molybdenum, and cobalt.

14. The adhesive film for a semiconductor of claim 1 ,

wherein the (meth)acrylate-based resin has a glass transition temperature of 10° C. to 20° C.