Prepreg, metal-clad laminated board, and printed wiring board
A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).
1. A prepreg comprising:
a woven cloth substrate; and
a semi-cured product of a resin composition impregnated into the woven cloth substrate,
the resin composition containing: at least one of an (A1) component and an (A2) component; a (B) component; a (C1) component; and a (C2) component,
the (A1) component being an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton,
the (A2) component being a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton,
the (B) component being a high molecular weight polymer which has a structure represented by at least a (b2) formula and a (b3) formula out of a (b1) formula, the (b2) formula, and the (b3) formula and has a weight average molecular weight of 200000 to 850000,
x in the (b1) formula, y in the (b2) formula and z in the (b3) formula satisfying a following relationship, x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (note that x+y+z≤1, 0≤x≤0.2, 0.6≤y≤0.95, and 0.05≤z≤0.2 being satisfied),
in the (b2) formula, R1 including a hydrogen atom or a methyl group, and R2 structures including at least one structure of a glycidyl group and an epoxylated alkyl group out of a hydrogen atom, an alkyl group, a glycidyl group, and an epoxylated alkyl group, R1 including a hydrogen atom or a methyl group, and R2 including at least one of a glycidyl group and an epoxylated alkyl group out of a hydrogen atom, an alkyl group, a glycidyl group, and an epoxylated alkyl group,
in the (b3) formula, R3 being a hydrogen atom or a methyl group, and R4 being Ph (a phenyl group), —COOCH 2 Ph, or —COO(CH 2 ) 2 Ph,
the (C1) component being a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by a (c1) formula,
[Chemical Formula 2]
(R6)Si(R5) 3 (C1)
in the (c1) formula, R5 being a methoxy group or an ethoxy group, and R6 having an isocyanate group, a glycidyl group, or an amino group at an end of an aliphatic alkyl group with the number of carbon atoms larger than or equal to 3 and smaller than or equal to 18,
the (C2) component being a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by a (c2) formula,
[Chemical Formula 3]
(R8)Si(R7) 3 (c2)
in the (c2) formula, R7 being a methoxy group or an ethoxy group, and R8 having a methacryloyl group or a vinyl group at an end of an aliphatic alkyl group with the number of carbon atoms larger than or equal to 3 and smaller than or equal to 18.
2. The prepreg according to claim 1 , wherein
the (C1) component or the (C2) component is a nanofiller having an average particle size of smaller than or equal to 100 nm.
3. The prepreg according to claim 2 , wherein
an amount of the nanofiller is within a range of 1 to 30 parts by mass with respect to 100 parts by mass of a total of the (A1) component, the (A2) component, and the (B) component.
4. The prepreg according to claim 1 , wherein
the resin composition does not contain an inorganic filler having an average particle size of larger than or equal to 45 μm.
5. The prepreg according to claim 1 , wherein
a weight ratio of a total of the (A1) component and the (A2) component to the (B) component is within a range of 90:10 to 50:50.
6. The prepreg according to claim 1 , wherein
a total amount of the (C1) component and the (C2) component is less than or equal to 80 weight % with respect to a total amount of the resin composition.
7. The prepreg according to claim 1 , wherein
a weight ratio of the (C1) component to the (C2) component is within a range of 98:2 to 60:40.
8. The prepreg according to claim 1 , wherein
the (A1) component and the (A2) component are not miscible with the (B) component and are phase-separated from the (B) component.
9. The prepreg according to claim 1 , wherein
an epoxy value of the (B) component is within a range of 0.01 to 0.80 eq/kg.
10. The prepreg according to claim 1 , wherein
the (B) component does not have an unsaturated bond between adjacent carbon atoms.
11. The prepreg according to claim 1 , wherein
the resin composition further comprises a phosphorus flame retardant.
12. The prepreg according to claim 1 , wherein
a thickness of the woven cloth substrate is within a range of 10 to 200 μm.
13. The prepreg according to claim 1 , wherein
a ratio of loss modulus to storage modulus is larger than or equal to 0.05 in a temperature range of lower than or equal to 100° C. and a temperature range of higher than or equal to 200° C., under a cured condition of the resin composition.
14. The prepreg according to claim 1 , wherein
a tensile elongation percentage of the prepreg in a oblique direction of 45° to warp or weft of the woven cloth substrate is larger than or equal to 5%, under the cured condition of the resin composition.
15. A metal-clad laminated board comprising:
a cured product of the prepreg according to claim 1 ; and
a metal foil bonded to the cured product.
16. A printed wiring board comprising:
a cured product of the prepreg according to claim 1 ; and
a conductive pattern provided on the cured product.