IP Library Granted Patent US 11,427,907
Granted Patent B2
US 11,427,907 · App. 16/318,645 · Granted Aug 30, 2022

Gas supply apparatus and gas supply method

Inventors: Takanori Aoki (Tokyo, JP); Katsumi Mikami (Kawasaki, JP)
Assignee: SHOWA DENKO K.K.
C23C16/4485C23C16/448F17C9/00F17C9/02F17C2205/0352F17C2227/0302F17C2250/043F17C2250/0439F17C2270/0518
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Quick Facts
Patent No.
US 11,427,907
App. No.
16/318,645
Granted
Aug 30, 2022
Kind
B2
Abstract

Provided is a gas supply apparatus for supplying a gas compound obtained by vaporizing a liquid compound to a target location, the gas supply apparatus comprising: a storage vessel capable of storing the liquid compound; a gas compound supply pipeline, one end of which is connected to the storage vessel, and another end of which is capable of being disposed at the target location; and a temperature control device configured to adjust a temperature of the gas compound or the liquid compound within the storage vessel to be equal to or lower than a surrounding temperature of the gas compound supply pipeline.

Claims (27)

1. A gas supply apparatus for supplying a gas compound obtained by vaporizing a liquid compound to a target location, the gas supply apparatus comprising:

a storage vessel capable of storing the liquid compound;

a gas compound supply pipeline, one end of which is connected to the storage vessel, and another end of which is capable of being disposed at the target location; and

a temperature control device configured to adjust a temperature of the gas compound or the liquid compound within the storage vessel to be equal to or lower than a surrounding temperature of the gas compound supply pipeline,

wherein the temperature control device is a device for cooling the storage vessel,

wherein the storage vessel comprises:

a storage vessel body; and

a connecting pipeline connecting a gas compound containing region of the storage vessel body to the gas compound supply pipeline, wherein the connecting pipeline is inclined upward relative to the horizontal from a storage vessel body side to a gas compound supply pipeline side.

2. The gas supply apparatus according to claim 1 , wherein the temperature control device comprises:

a liquid temperature measuring device configured to measure the temperature of the liquid compound within the storage vessel; and

a heat transfer device configured to receive a signal relating to the temperature measured by the liquid temperature measuring device to give or receive heat to or from the storage vessel so as to adjust the measured temperature to be equal to or lower than the surrounding temperature of the gas compound supply pipeline.

3. The gas supply apparatus according to claim 1 , wherein the temperature control device comprises:

a gas temperature measuring device configured to measure the temperature of the gas compound within the storage vessel; and

a heat transfer device configured to receive a signal relating to the temperature measured by the gas temperature measuring device to give or receive heat to or from the storage vessel so as to adjust the measured temperature to be equal to or lower than the surrounding temperature of the gas compound supply pipeline.

4. The gas supply apparatus according to claim 1 , wherein the temperature control device comprises:

a pressure measuring device configured to measure a pressure of the gas compound within the storage vessel; and

a heat transfer device configured to receive a signal relating to the pressure measured by the pressure measuring device to give or receive heat to or from the storage vessel so as to adjust the measured pressure to be equal to or lower than a saturated vapor pressure of the gas compound at a temperature equal to the surrounding temperature of the gas compound supply pipeline.

5. The gas supply apparatus according to claim 1 , the gas supply apparatus further comprising a surrounding temperature measuring device configured to measure the surrounding temperature of the gas compound supply pipeline and send a signal relating to the surrounding temperature to the heat transfer device.

6. The gas supply apparatus according to claim 1 , wherein a mass flow controller is disposed midway of the gas compound supply pipeline.

7. The gas supply apparatus according to claim 1 , wherein a pressure of the gas compound within the storage vessel is higher than a pressure in the target location.

8. A gas supply apparatus for supplying a gas compound obtained by vaporizing a liquid compound to a target location, the gas supply apparatus comprising:

a storage vessel capable of storing the liquid compound;

a gas compound supply pipeline, one end of which is connected to the storage vessel, and another end of which is capable of being disposed at the target location; and

a temperature control device configured to adjust a temperature of the gas compound or the liquid compound within the storage vessel to be equal to or lower than a surrounding temperature of the gas compound supply pipeline,

wherein the temperature control device is a device for cooling the storage vessel,

the gas supply apparatus further comprising a casing or a housing chamber accommodating the storage vessel, the temperature control device, and the gas compound supply pipeline, and

wherein the casing or the housing chamber comprises an air conditioning device configured to control a temperature of an interior space of the casing or the housing chamber.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2019
From: AOKI, TAKANORI; MIKAMI, KATSUMI
To: SHOWA DENKO K.K.
Reel/Frame 048058/0667 →
Priority Claims (1)
JP JP2016-142652 · Jul 20, 2016 · national
Continuity (1)
Related Publication 20190292660A1 · Sep 26, 2019