IP Library › Granted Patent US 10,866,667
Granted Patent B2
US 10,866,667 · App. 16/320,722 · Granted Dec 15, 2020

Touch pressure control method and device

Inventors: Wentao Wang (Weifang, CN); Tianduo Zhou (Weifang, CN); Zhongkai Li (Weifang, CN)
Assignee: Weifang Goertek Microelectronics Co., Ltd.
G06F3/0412G06F3/03547G06F3/0414G06F3/0416G06F3/0488G06F2203/0339
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,866,667
App. No.
16/320,722
Granted
Dec 15, 2020
Kind
B2
Abstract

A touch pressure control method and device are provided. The touch pressure control method comprises: determining, according to a first pressure value and a second pressure value generated in response to a single touch operation, a pressure level and a touch point position corresponding to the touch operation; and selecting, according to the pressure level and the touch point position, a corresponding function or application from a function and application list, and controlling an implementation of the function or application.

Claims (25)

1. A touch pressure control method performed by a processor configured with instructions and comprising the steps of:

according to a first pressure value and a second pressure value generated in response to a single touch operation, determining a pressure level and a touch point position corresponding to the touch operation by the processor configured with the instructions; and

according to the pressure level and the touch point position, selecting a corresponding function or application from a function and application list and controlling an implementation of the function or application by the processor configured with the instructions,

wherein the step of, according to the first pressure value and the second pressure value generated in response to the single touch operation, determining the pressure level and the touch point position corresponding to the touch operation by the processor configured with the instructions, comprises:

according to a sum of the first pressure value and the second pressure value, determining the pressure level corresponding to the touch operation by the processor configured with the instructions; and

according to a ratio of the first pressure value to the second pressure value, determining the touch point position corresponding to the touch operation by the processor configured with the instructions.

2. The touch pressure control method according to claim 1 , further comprising:

determining a pressure duration corresponding to the touch operation by the processor configured with the instructions; and

according to the pressure level, the touch point position and the pressure duration, selecting the corresponding function or application from the function and application list and controlling the implementation of the function or application by the processor configured with the instructions.

3. The touch pressure control method according to claim 1 , further comprising:

resetting the function and application list in response to an external setting request by the processor configured with the instructions.

4. The touch pressure control method according to claim 1 , further comprising:

acquiring the first pressure value generated in response to the touch operation by a first pressure sensor and the second pressure value generated in response to the touch operation by a second pressure sensor by the processor configured with the instructions.

5. A touch pressure control device, comprising a processor and memory for storing instructions, wherein the processor is configured with the instructions to implement the following units:

a parameter determination unit configured to, according to a first pressure value and a second pressure value generated in response to a single touch operation, determine a pressure level and a touch point position corresponding to the touch operation; and

a function control unit configured to, according to the pressure level and the touch point position, select a corresponding function or application from a function and application list, and control an implementation of the function or application,

wherein the parameter determination unit at least comprises:

a means configured to, according to a sum of the first pressure value and the second pressure value, determine to, according to a ratio of the first pressure value to the second pressure

a means configured to, according to a ratio of the first pressure value to the second pressure value, determine the touch point position corresponding to the touch operation.

6. The touch pressure control device according to claim 5 , wherein the parameter determination unit further comprises a means configured to determine a pressure duration corresponding to the touch operation; and

the function control unit are is configured to, according to the pressure level, the touch point position and the pressure duration, select the corresponding function or application from the function and application list, and control the implementation of the function or application.

7. The touch pressure control device according to claim 5 , wherein the processor is further configured with the instructions to implement the following unit:

a means a reset unit configured to reset the function and application list in response to an external setting request.

8. The touch pressure control device according to claim 5 , wherein the processor is further configured with the instructions to implement the following unit:

a means an acquirement unit configured to acquire the first pressure value generated in response to the touch operation by a first pressure sensor and the second pressure value generated in response to the touch operation by a second pressure sensor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2020
From: GOERTEK, INC.
To: WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
Reel/Frame 052846/0443 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2019
From: WANG, WENTAO; ZHOU, TIANDUO; LI, ZHONGKAI
To: GOERTEK INC.
Reel/Frame 048156/0751 →
Priority Claims (1)
CN 2016 1 0640948 · Aug 5, 2016 · national
Continuity (1)
Related Publication 20190163308A1 · May 30, 2019