Apparatus, system and method of providing a FFF printing nozzle
View Patent ↗An apparatus, system and method for providing a nozzle having refined print control and enhanced printing speed by providing, on the inside or outside or on an interstitial substrate layer, of any metallic or non-metallic nozzle of a non-conductive surface suitable to support sensors relevant to the FFF process. Heat, force, flow, strain, stress, extrusion force, and like sensors may be provided on the inside or the outside of any nozzle, or on an interstitial substrate layer on the inside or outside of any nozzle. The sensors may be provided about the center access through the nozzle, longitudinally along the center access of the nozzle, or at any of various points along the nozzle, wherein the placement or shape of such sensors may vary in accordance with the type of sensing to be performed by the subject sensor.
1. A device, comprising:
an inner chamber enclosing and in direct contact with printing material terminating in an orifice to output the printing material with a flow rate;
an outer shaft about the inner chamber and including the orifice;
at least one dielectric substrate integrated onto one of the inner chamber, the outer shaft, or the orifice;
an inductive heater comprising a conductive trace that applies inductive heat to the outer shaft to liquefy the print material in the inner chamber into a liquid flow having the flow rate;
an ultra-sonic transducer distal to the orifice that also liquefies the print material, in conjunction with the first liquefication energy source, into the liquid flow; and
a single micro-manufactured strain gauge upon the dielectric substrate and capable of sensing pressure at one of the inner chamber, the outer chamber, and the orifice during the output, the pressure being indicative of the flow rate of the printing material during the output.
2. The device of claim 1 , wherein dielectric substrate comprises glass or ceramic.
3. The device of claim 1 , wherein the dielectric substrate comprises a sheath.
4. The device of claim 1 , wherein the dielectric substrate comprises a film.
5. The device of claim 1 , wherein the dielectric substrate comprises an applied coating.
6. The device of claim 5 , wherein the applied coating comprises one of a vacuum deposition, CVD, PVD, and a sputtered applied coating.
7. The device of claim 1 , wherein the second liquefication energy source is an ultrasonic transducer.
8. The device of claim 1 , wherein the dielectric substrate comprises silica or quartz.