Laser irradiation apparatus, method for manufacturing semiconductor device, and method for operating laser irradiation apparatus
A laser annealing apparatus ( 1 ) according to an embodiment includes a laser oscillator ( 4 ) configured to generate a laser beam (L), a floating-type conveying stage ( 3 ) configured to float and convey a workpiece (W) to be irradiated with the laser beam (L), and a beam profiler ( 7 ) configured to measure a beam profile of the laser beam (L). The floating-type conveying stage ( 3 ) includes a conveying surface ( 3 a ) opposed to the workpiece (W), and a bottom surface ( 3 b ) on the side opposite to the conveying surface ( 3 a ). The beam profiler ( 7 ) is positioned below the bottom surface ( 3 b ) of the floating-type conveying stage ( 3 ). The floating-type conveying stage ( 3 ) includes a detachable part ( 12 ) in a part of it. An opening (S) is formed by detaching the detachable part ( 12 ) from the floating-type conveying stage ( 3 ), the opening ( 3 ) extending from the conveying surface ( 3 a ) to the bottom surface ( 3 b ). The beam profiler ( 7 ) is configured to measure the beam profile of the laser beam (L) through the opening (S).
1. A laser irradiation apparatus comprising:
a laser oscillator configured to generate a laser beam;
a conveying stage configured to float and convey a workpiece to be irradiated with the laser beam; and
a measuring instrument configured to measure a beam profile of the laser beam, wherein
the conveying stage includes a conveying surface opposed to the workpiece, and a bottom surface on the side opposite to the conveying surface,
the measuring instrument is positioned below the bottom surface of the conveying stage,
the conveying stage includes a detachable part in a part of the conveying stage, the detachable part being configured to be detachable from the conveying stage,
an opening is formed in the conveying stage by detaching the detachable part from the conveying stage, the opening extending from the conveying surface to the bottom surface, and
the measuring instrument is configured to measure the beam profile of the laser beam through the opening.
2. The laser irradiation apparatus according to claim 1 , wherein the detachable part is positioned on an optical axis of the laser beam.
3. The laser irradiation apparatus according to claim 1 , wherein the measuring instrument is configured to move to a position of the opening.
4. The laser irradiation apparatus according to claim 1 , wherein the measuring instrument is configured to measure the beam profile of the laser beam at a focal point thereof.
5. The laser irradiation apparatus according to claim 1 , wherein the opening and the measuring instrument are positioned on an optical axis of the laser beam.
6. The laser irradiation apparatus according to claim 1 , wherein
a planar shape of the laser beam is a rectangle having a long axis and a short axis, and
the measuring instrument is configured to move along the long axis.
7. The laser irradiation apparatus according to claim 1 , wherein the workpiece is floated by gas ejected from the conveying stage toward the workpiece.
8. The laser irradiation apparatus according to claim 1 , wherein the workpiece includes an amorphous semiconductor film, and a polycrystalline semiconductor film is formed by applying the laser beam to the amorphous semiconductor film.
9. A method for manufacturing a semiconductor device, comprising the steps of:
(a) floating and conveying a workpiece including an amorphous semiconductor film over a conveying stage;
(b) applying a laser beam to the amorphous semiconductor film and thereby forming a polycrystalline semiconductor film;
(c) removing a detachable part of the conveying stage and thereby forming an opening in a part of the conveying stage; and
(d) measuring a beam profile of the laser beam through the opening.
10. The method for manufacturing a semiconductor device according to claim 9 , further comprising, between the steps (c) and (d), a step of moving a measuring instrument to a position of the opening, the measuring instrument being configured to measure the beam profile of the laser beam.
11. The method for manufacturing a semiconductor device according to claim 9 , wherein the opening and a measuring instrument configured to measure the beam profile of the laser beam are positioned on an optical axis of the laser beam.
12. The method for manufacturing a semiconductor device according to claim 9 , wherein in the step (a), the workpiece is floated by gas ejected from the conveying stage toward the workpiece.
13. The method for manufacturing a semiconductor device according to claim 9 , wherein the workpiece includes a glass substrate.
14. The method for manufacturing a semiconductor device according to claim 9 , wherein the polycrystalline semiconductor film forms a thin-film transistor.
15. The method for manufacturing a semiconductor device according to claim 14 , wherein the thin-film transistor is used to control a liquid crystal display device or an organic EL display device.
16. A method for operating a laser irradiation apparatus, comprising the steps of:
(a) floating and conveying a workpiece over a conveying stage;
(b) applying a laser beam to the workpiece;
(c) removing a detachable part of the conveying stage and thereby forming an opening in a part of the conveying stage; and
(d) measuring a beam profile of the laser beam through the opening.
17. The method for operating the laser irradiation apparatus according to claim 16 , further comprising, between the steps (c) and (d), a step of moving a measuring instrument to a position of the opening, the measuring instrument being configured to measure the beam profile of the laser beam.
18. The method for operating the laser irradiation apparatus according to claim 16 , wherein the opening and a measuring instrument configured to measure the beam profile of the laser beam are positioned on an optical axis of the laser beam.
19. The method for operating the laser irradiation apparatus according to claim 16 , wherein in the step (a), the workpiece is floated by gas ejected from the conveying stage toward the workpiece.