Curable resin composition, cured product thereof, and semiconductor device

1. A curable resin composition comprising: a component (A), a component (B), a component (C), a component (D), and a component (E) below;

a content of the component (B) per 100 parts by weight of the component (A) being from 5 to 50 parts by weight;

a content of the component (C) per 100 parts by weight of the component (A) being from 0 to 10 parts by weight;

a content of the component (D) being an amount that makes the amount of an SiH group (hydrosilyl group) present in the component (D) from 0.5 to 5 mol per 1 mol of an alkenyl group present in the component (A), the component (B), and the component (C); and

a total content of the component (B), the component (C), and the component (D) per 100 parts by weight of the component (A) being not greater than 80 parts by weight;

(A): a polyorganosiloxane represented by Average Unit Formula (I) below:

(SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 2 SiO 2/2 ) a3 (R 1 3 SiO 1/2 ) a4   (I)

wherein R 1 is, the same or different, an alkyl group having from 1 to 10 carbons, an aryl group having from 6 to 14 carbons, an alkenyl group having from 2 to 8 carbons, an alkoxy group having from 1 to 10 carbons, or a hydroxy group; in the case where a proportion of the alkyl group is X mol %, a proportion of the aryl group is Y mol %, and a proportion of the alkenyl group is Z mol % relative to a total amount (100 mol %) of R 1 , X is from 30 to 98 mol %, Y is from 1 to 50 mol %, and Z is from 1 to 20 mol %; a ratio of X to Y (X/Y) is from 5.5 to 25, and a1, a2, a3, and a4 are each a number satisfying a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1;

(B): a polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %;

(C): an organopolysiloxane represented by Average Unit Formula (X) below:

(R x SiO 3/2 ) x1 (R x 2 SiO 2/2 ) x2 (R x 2 SiR A R x 2 SiO 2/2 ) x3 (R x 3 SiO 1/2 ) x4   (X)

wherein R x is, the same or different, an alkyl group having from 1 to 10 carbons, an aryl group having from 6 to 14 carbons, an alkenyl group having from 2 to 8 carbons, an alkoxy group having from 1 to 10 carbons, or a hydroxy group; a proportion of the aryl group relative to a total amount (100 mol %) of R x is from 1 to 50 mol %, and at least two of all the R x moieties are alkenyl groups; R A is a divalent hydrocarbon group; and x1, x2, x3, and x4 are each a number satisfying 0.05>x1≥0, x2+x3>0, x4>0, and x1+x2+x3+x4=1;

(D) a polyorganosiloxane represented by Average Composition Formula (II) below:

R 2 m H n SiO [(4-m-n)/2]   (II)

wherein R 2 is, the same or different, an alkyl group having from 1 to 10 carbons or an aryl group having from 6 to 14 carbons, and at least two hydrogen atoms are bonded to the silicon atom; and m and n are each a number satisfying 0.7≤m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3; and

(E): a hydrosilylation catalyst.

2. The curable resin composition according to claim 1 , wherein a viscosity at 23° C. is not greater than 20000 mPa·s.

3. The curable resin composition according to claim 1 , wherein, a cured product prepared by heating and curing the curable resin composition in at least one curing condition selected from 25 to 180° C. and from 5 to 720 minutes has a type D hardness of not less than 40, the type D hardness being measured by using a type D durometer according to JIS K 6253, and a tensile elongation of not less than 50%, the tensile elongation being measured according to JIS K 6251.

4. The curable resin composition according to claim 1 , wherein

the component (A) is a polyorganosiloxane

that has a weight-average molecular weight of 500 to 50000 based on calibration with polystyrene,

has a molecular weight distribution of 1 to 4, and

is a solid or liquid having a viscosity at 25° C. of not less than 10 mPas.

5. The curable resin composition according to claim 1 , further comprising a component (F) below:

(F): a silsesquioxane having at least one alkenyl group and at least one aryl group in a molecule.

6. The curable resin composition according to claim 1 , wherein the component (D) contains at least two structural units represented by R 2′ 2 HSiO 1/2 where wherein R 2′ is, the same or different, an alkyl group having from 1 to 10 carbons or an aryl group having from 6 to 14 carbons.

7. The curable resin composition according to claim 1 , wherein the component (D) contains not less than 1 wt. % and not greater than 99 wt. % of a component (B1), the component (B1) being represented by Formula (II-1) below:

wherein R 21 is, the same or different, an alkyl group having from 1 to 10 carbons or an aryl group having from 6 to 14 carbons, and x represents an integer from 0 to 1000; and

the component (B1) being a liquid having a viscosity at 25° C. of not greater than 10000 mPa·s.

8. The curable resin composition according to claim 1 , wherein the component (D) contains one type of polyorganosiloxane represented by Average Composition Formula (II) or at least two different types of polyorganosiloxanes represented by Average Composition Formula (II).

9. The curable resin composition according to claim 1 , wherein the component (D) contains at least one type of polyorganosiloxane represented by Average Formula (II), wherein at least one of the R 2 moieties is an aryl group having from 6 to 14 carbons.

10. The curable resin composition according to claim 1 , further comprising a silane coupling agent (G).

11. A cured product of the curable resin composition described in claim 1 .

12. The cured product according to claim 11 , wherein a refractive index at 589 nm is from 1.46 to 1.54.

13. The curable resin composition according to claim 1 , wherein the curable resin composition is an encapsulating agent.

14. The curable resin composition according to claim 1 , wherein the curable resin composition is a lens-forming resin composition.

15. A semiconductor device comprising: a semiconductor element and an encapsulant that encapsulates the semiconductor element,

the encapsulant being a cured product of the curable resin composition described in claim 13 .

16. A semiconductor device comprising: a semiconductor element and a lens,

the lens being a cured product of the curable resin composition described in claim 14 .

17. A semiconductor device comprising: a semiconductor element, an encapsulant that encapsulates the semiconductor element, and a lens,

the encapsulant being a cured product of the curable resin composition described in claim 1 , and

the lens being a cured product of the curable resin composition described in claim 1 .

18. The semiconductor device according to claim 15 , wherein a refractive index of the cured product at 589 nm is from 1.46 to 1.54.

19. The semiconductor device according to claim 15 , wherein the semiconductor device is an optical semiconductor device.

20. A curable resin composition comprising: a component (A), a component (B), a component (C), a component (D), and a component (E) below;

a content of the component (B) per 100 parts by weight of the component (A) being from 5 to 50 parts by weight;

a content of the component (C) per 100 parts by weight of the component (A) being from 0 to 10 parts by weight;

a content of the component (D) being an amount that makes the amount of an SiH group (hydrosilyl group) present in the component (D) from 0.5 to 5 mol per 1 mol of an alkenyl group present in the component (A), the component (B), and the component (C); and

a total content of the component (B), the component (C), and the component (D) per 100 parts by weight of the component (A) being not greater than 80 parts by weight;

(A): a polyorganosiloxane represented by Average Unit Formula (I) below:

(SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 2 SiO 2/2 ) a3 (R 1 3 SiO 1/2 ) a4   (I)

wherein R 1 is, the same or different, an alkyl group having from 1 to 10 carbons, an aryl group having from 6 to 14 carbons, an alkenyl group having from 2 to 8 carbons, an alkoxy group having from 1 to 10 carbons, or a hydroxy group; in the case where a proportion of the alkyl group is X mol %, a proportion of the aryl group is Y mol %, and a proportion of the alkenyl group is Z mol % relative to a total amount (100 mol %) of R 1 , X is from 30 to 98 mol %, Y is from 1 to 14 mol %, and Z is from 1 to 20 mol %; and a1, a2, a3, and a4 are each a number satisfying a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1;

(B): a polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %;

(C): an organopolysiloxane represented by Average Unit Formula (X) below:

(R x SiO 3/2 ) x1 (R x 2 SiO 2/2 ) x2 (R x 2 SiR A R x 2 SiO 2/2 ) x3 (R x 3 SiO 1/2 ) x2   (X)

wherein R x is, the same or different, an alkyl group having from 1 to 10 carbons, an aryl group having from 6 to 14 carbons, an alkenyl group having from 2 to 8 carbons, an alkoxy group having from 1 to 10 carbons, or a hydroxy group; a proportion of the aryl group relative to a total amount (100 mol %) of R x is from 1 to 50 mol %, and at least two of all the R x moieties are alkenyl groups; R A is a divalent hydrocarbon group; and x1, x2, x3, and x4 are each a number satisfying 0.05>x1≥0, x2+x3>0, x4>0, and x1+x2+x3+x4=1;

(D) a polyorganosiloxane represented by Average Composition Formula (II) below:

R 2 m H n SiO [(4-m-n)/2]   (II)

wherein R 2 is, the same or different, an alkyl group having from 1 to 10 carbons or an aryl group having from 6 to 14 carbons, and at least two hydrogen atoms are bonded to the silicon atom; and m and n are each a number satisfying 0.7≤m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3; and

(E): a hydrosilylation catalyst.

21. A curable resin composition comprising: a component (A), a component (B), a component (C), a component (D), and a component (E) below;

a content of the component (B) per 100 parts by weight of the component (A) being from 5 to 50 parts by weight;

a content of the component (C) per 100 parts by weight of the component (A) being from 1 to 10 parts by weight;

a content of the component (D) being an amount that makes the amount of an SiH group (hydrosilyl group) present in the component (D) from 0.5 to 5 mol per 1 mol of an alkenyl group present in the component (A), the component (B), and the component (C); and

a total content of the component (B), the component (C), and the component (D) per 100 parts by weight of the component (A) being not greater than 80 parts by weight;

(A): a polyorganosiloxane represented by Average Unit Formula (I) below:

(SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 2 SiO 2/2 ) a3 (R 1 3 SiO 1/2 ) a4   (I)

wherein R 1 is, the same or different, an alkyl group having from 1 to 10 carbons, an aryl group having from 6 to 14 carbons, an alkenyl group having from 2 to 8 carbons, an alkoxy group having from 1 to 10 carbons, or a hydroxy group; in the case where a proportion of the alkyl group is X mol %, a proportion of the aryl group is Y mol %, and a proportion of the alkenyl group is Z mol % relative to a total amount (100 mol %) of R 1 , X is from 30 to 98 mol %, Y is from 1 to 50 mol %, and Z is from 1 to 20 mol %; and a1, a2, a3, and a4 are each a number satisfying a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1;

(B): a polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %;

(C): an organopolysiloxane represented by Average Unit Formula (X) below:

(R x SiO 3/2 ) x1 (R x 2 SiO 2/2 ) x2 (R x 2 SiR A R x 2 SiO 2/2 ) x3 (R x 3 SiO 1/2 ) x4   (X)

wherein R x is, the same or different, an alkyl group having from 1 to 10 carbons, an aryl group having from 6 to 14 carbons, an alkenyl group having from 2 to 8 carbons, an alkoxy group having from 1 to 10 carbons, or a hydroxy group; a proportion of the aryl group relative to a total amount (100 mol %) of R x is from 1 to 50 mol %, and at least two of all the R x moieties are alkenyl groups; R A is a divalent hydrocarbon group; and x1, x2, x3, and x4 are each a number satisfying 0.05>x1≥0, x2+x3>0, x4>0, and x1+x2+x3+x4=1;

(D) a polyorganosiloxane represented by Average Composition Formula (II) below:

R 2 m H n SiO [(4-m-n)/2]   (II)

wherein R 2 is, the same or different, an alkyl group having from 1 to 10 carbons or an aryl group having from 6 to 14 carbons, and at least two hydrogen atoms are bonded to the silicon atom; and m and n are each a number satisfying 0.7≤m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3; and

(E): a hydrosilylation catalyst.

22. A curable resin composition comprising: a component (A), a component (B), a component (C), a component (D), a component (E), and a component (F) below;

a content of the component (B) per 100 parts by weight of the component (A) being from 5 to 50 parts by weight;

a content of the component (C) per 100 parts by weight of the component (A) being from 0 to 10 parts by weight;

a content of the component (D) being an amount that makes the amount of an SiH group (hydrosilyl group) present in the component (D) from 0.5 to 5 mol per 1 mol of an alkenyl group present in the component (A), the component (B), and the component (C); and

a total content of the component (B), the component (C), and the component (D) per 100 parts by weight of the component (A) being not greater than 80 parts by weight;

(A): a polyorganosiloxane represented by Average Unit Formula (I) below:

(SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 2 SiO 2/2 ) a3 (R 1 3 SiO 1/2 ) a4   (I)

wherein R 1 is, the same or different, an alkyl group having from 1 to 10 carbons, an aryl group having from 6 to 14 carbons, an alkenyl group having from 2 to 8 carbons, an alkoxy group having from 1 to 10 carbons, or a hydroxy group; in the case where a proportion of the alkyl group is X mol %, a proportion of the aryl group is Y mol %, and a proportion of the alkenyl group is Z mol % relative to a total amount (100 mol %) of X is from 30 to 98 mol %, Y is from 1 to 50 mol %, and Z is from 1 to 20 mol %; and a1, a2, a3, and a4 are each a number satisfying a1>0, a2>0, a3>0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1;

(B): a polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %;

(C): an organopolysiloxane represented by Average Unit Formula (X) below:

(R x SiO 3/2 ) x1 (R x 2 SiO 2/2 ) x2 (R x 2 SiR A R x 2 SiO 2/2 ) x3 (R x 3 SiO 1/2 ) x4   (X)

wherein R x is, the same or different, an alkyl group having from 1 to 10 carbons, an aryl group having from 6 to 14 carbons, an alkenyl group having from 2 to 8 carbons, an alkoxy group having from 1 to 10 carbons, or a hydroxy group; a proportion of the aryl group relative to a total amount (100 mol %) of R x is from 1 to 50 mol %, and at least two of all the R x moieties are alkenyl groups; R A is a divalent hydrocarbon group; and x1, x2, x3, and x4 are each a number satisfying 0.05>x1≥0, x2+x3>0, x4>0, and x1+x2+x3+x4=1;

(D) a polyorganosiloxane represented by Average Composition Formula (II) below:

R 2 m H n SiO [(4-m-n)/2]   (II)

wherein R 2 is, the same or different, an alkyl group having from 1 to 10 carbons or an aryl group having from 6 to 14 carbons, and at least two hydrogen atoms are bonded to the silicon atom; and m and n are each a number satisfying 0.7≤m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3; and

(E): a hydrosilylation catalyst; and

(F): a silsesquioxane having at least one alkenyl group and at least one aryl group in a molecule.