MATERIAL MIXTURE, METHOD FOR PROTECTING A COMPONENT, METHOD FOR LASER DRILLING, AND COMPONENT

1 . A material mixture for protection in a laser processing operation,

which is especially pulverulent, the material mixture comprising:

at least one amino acid;

at least one lipid;

at least one polysaccharide, especially heteropolysaccharides; and

at least one salt, especially pyruvate, and

at least one sulfate.

2 . The material mixture as claimed in claim 1 , in which the at least one amino acid includes at least (C 12 H 18 O 9 ) x .

3 . The material mixture as claimed in claim 1 , in which the at least one saccharide includes C 3 H 6 O 3 , C 12 H 22 O 11 and/or C 6 H 12 O 6 .

4 . The material mixture as claimed in claim 1 , in which the at least one lipid includes C 4-18 H 8-36 O 2 , especially 13 triglycerides.

5 . A slip, including a liquid and the material mixture as claimed in claim 1 .

6 . A method of protecting a component when working with an energy beam,

in laser drilling, wherein the component has a cavity, wherein a through-hole is introduced through a wall of the cavity of the component, the method comprising:

filling the cavity at least in a region of a region to be processed, with the material mixture as claimed in claim 1 or a slip.

7 . The method as claimed in claim 6 , in which the entire cavity is filled with the material mixture.

8 . The method as claimed in claim 6 , in which the material mixture is heated prior to the processing at 373 K to 383 K for 10 min to 120 min.

9 . A method of laser drilling a component, in which a through-hole is introduced through a wall of the cavity of the component, and a method of protecting the cavity as claimed in claim 6 is used.

10 . The method as claimed in claim 9 , in which the component is cleared by washing or boiling to remove the material from the cavity.

11 . A hollow cavity with a material mixture as claimed in claim 1 or a slip in the cavity.