POLYIMIDE FILM FOR METAL LAMINATION AND POLYIMIDE METAL LAMINATE USING SAME
The present invention discloses a polyimide film for metal lamination, which is obtained by providing at least one surface of a heat-resistant polyimide layer with a metal bonding layer. This polyimide film has a 5% weight loss temperature of 500° C. or higher in a nitrogen atmosphere, while having a dielectric loss tangent of 0.007 or less at a frequency of 11.4 GHz. It is preferable that the metal bonding layer is formed of a thermally fusible polyimide, or is formed of a heat-resistant polyimide and a silane coupling agent. The present invention also discloses a polyimide metal laminate which is obtained by additionally laminating a metal layer on a surface of the above-described polyimide film for metal lamination, said surface having been provided with the metal bonding layer.
1 . A polyimide film for metal lamination comprising a heat-resistant polyimide layer and a metal adhesion layer which is provided on at least one side of the heat-resistant polyimide layer,
a 5% weight loss temperature in a nitrogen atmosphere being 500° C. or greater, and
a dielectric loss tangent at a frequency of 11.4 GHz being 0.007 or less.
2 . The polyimide film for metal lamination according to claim 1 ,
wherein a polyimide that composes the heat-resistant polyimide layer is a polyimide including a repeating unit represented by a chemical formula (1) below:
wherein, in the formula (1),
A represents a group represented by a chemical formula (2) above in an amount of 50 to 100 mol % and a group represented by a chemical formula (3) above in an amount of 0 to 50 mol %,
B represents a group represented by a chemical formula (4) above in an amount of 50 to 100 mol % and may optionally include two or more types of groups, and, in the formula (4), “n” represents an integer of 1 to 4.
3 . The polyimide film for metal lamination according to claim 1 ,
wherein the metal adhesion layer comprises a thermal fusion-bondable polyimide.
4 . The polyimide film for metal lamination according to claim 1 ,
wherein the metal adhesion layer comprises a heat-resistant polyimide and a silane coupling agent.
5 . A polyimide metal laminate comprising: the polyimide film for metal lamination according to claim 1 ; and a metal layer laminated on the side of the polyimide film on which the metal adhesion layer is arranged.
6 . The polyimide film for metal lamination according to claim 2 , wherein the metal adhesion layer comprises a thermal fusion-bondable polyimide.
7 . The polyimide film for metal lamination according to claim 2 , wherein the metal adhesion layer comprises a heat-resistant polyimide and a silane coupling agent.
8 . A polyimide metal laminate comprising:
the polyimide film for metal lamination according to claim 2 ; and
a metal layer laminated on the side of the polyimide film on which the metal adhesion layer is arranged.
9 . A polyimide metal laminate comprising:
the polyimide film for metal lamination according to claim 3 ; and
a metal layer laminated on the side of the polyimide film on which the metal adhesion layer is arranged.
10 . A polyimide metal laminate comprising:
the polyimide film for metal lamination according to claim 4 ; and
a metal layer laminated on the side of the polyimide film on which the metal adhesion layer is arranged.
11 . A polyimide metal laminate comprising:
the polyimide film for metal lamination according to claim 6 ; and
a metal layer laminated on the side of the polyimide film on which the metal adhesion layer is arranged.
12 . A polyimide metal laminate comprising:
the polyimide film for metal lamination according to claim 7 ; and
a metal layer laminated on the side of the polyimide film on which the metal adhesion layer is arranged.