Film-forming device
A film-forming device according to one embodiment includes a chamber body, a support, a moving device, a shielding member, a first holder and a second holder, in the film-forming device, a substrate supported by the support is linearly moved. The shielding member is disposed above an area where the substrate is moved, and includes a slit extending in a direction perpendicular to a movement direction of the substrate. The first holder and the second holder hold a first target and a second target, respectively, above the shielding member. The first target and the second target are arranged symmetrically with respect to a vertical plane including a linear path on which the center of the substrate is moved.
1. A film-forming device for forming a film on a substrate by sputtering, comprising:
a chamber body;
a support configured to support the substrate within the chamber body;
a moving device configured to move the support and thereby move a center of the substrate supported by the support on a linear path in a horizontal plane;
a shield, in which a slit is formed, disposed above an area where the substrate is moved by the moving device, the slit extending in a direction perpendicular to a movement direction of the substrate by the moving device and extending symmetrically with respect to a vertical plane that extends in the movement direction and includes the linear path;
a first holder configured to hold a first target above the shield such that a first normal direction which is a direction normal to a surface of the first target is inclined downward and the surface of the first target faces the substrate moved by the moving device via the slit; and
a second holder configured to hold a second target above the shield such that a second normal direction which is a direction normal to a surface of the second target is inclined downward and the surface of the second target faces the substrate moved by the moving device via the slit,
wherein the first holder and the second holder are disposed to arrange the first target and the second target symmetrically with each other with respect to the vertical plane, such that the vertical plane passes through a gap between the first target and the second target in a plan view, wherein the first target is entirely on one side of the vertical plane, and the second target is entirely on the opposite side of the vertical plane, and wherein both the first target and the second target are on the same side of the slit, and
wherein the first holder and the second holder hold the first target and the second target, respectively, such that the first normal direction and the second normal direction are both parallel to the movement direction and the vertical plane in the plan view.
2. The film-forming device of claim 1 , further comprising:
one or more power supplies configured to apply voltage to the first target and the second target; and
a controller configured to control an application of the voltage to the first target and the second target by the one or more power supplies,
wherein the controller controls the one or more power supplies to eject target materials from the first target and the second target simultaneously.
3. The film-forming device of claim 1 , wherein the first holder and the second holder hold the first target and the second target, respectively, such that a distance between a center of the surface of the first target and a center of the surface of the second target is greater than a width of the substrate in the direction perpendicular to the movement direction, and equal to or smaller than 2.66 times the width of the substrate in the direction perpendicular to the movement direction.