Epoxy resin composition and structure
An epoxy resin composition of the present invention includes an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator, in which a maximum exothermic peak temperature in a DSC curve of the epoxy resin composition obtained in a case of elevating a temperature from 30° C. to 200° C. under a condition of a temperature elevating rate of 10° C./min using a differential scanning calorimeter is equal to or higher than 80° C. and equal to or lower than 145° C.
1. An epoxy resin composition comprising:
an epoxy resin;
a curing agent;
an inorganic filler; and
a curing accelerator,
wherein the curing accelerator includes an imidazole-based curing accelerator,
wherein a content of the epoxy resin is equal to or more than 8% by mass and equal to or less than 20% by mass with respect to the total solid content of the epoxy resin composition,
wherein a content of the imidazole-based curing accelerator is equal to or more than 4.0% by mass and equal to or less than 12.0% by mass with respect to the total solid content of the epoxy resin composition, and
wherein a maximum exothermic peak temperature in a DSC curve of the epoxy resin composition obtained in a case of elevating a temperature from 30° C. to 200° C. under a condition of a temperature elevating rate of 10° C./min using a differential scanning calorimeter is equal to or higher than 80° C. and equal to or lower than 145° C.
2. The epoxy resin composition according to claim 1 ,
wherein a glass transition temperature of a cured product of the epoxy resin composition is equal to or higher than 140° C. and equal to or lower than 250° C.
3. The epoxy resin composition according to claim 1 ,
wherein an exothermic onset temperature in the DSC curve is in a range equal to or higher than 70° C. and equal to or lower than 110° C.
4. The epoxy resin composition according to claim 1 ,
wherein the DSC curve has one exothermic peak exceeding 30% of ΔH 1 which represents a difference between a heat release amount height H 1 at 70° C. and a heat release amount height H MAX at the maximum exothermic peak temperature.
5. The epoxy resin composition according to claim 1 ,
wherein a time taken from the initiation of measurement of a torque value with a curelastometer at 120° C. to the arrival of the torque value to 2 N·m is equal to or more than 30 seconds and equal to or less than 300 seconds.
6. The epoxy resin composition according to claim 1 ,
wherein a minimum melt viscosity of a high performance flow tester as measured at 120° C. and a load of 40 kgf is equal to or more than 20 Pa·s and equal to or less than 100 Pa·s.
7. The epoxy resin composition according to claim 1 ,
wherein a heat release amount difference between a heat release amount at 70° C. and a heat release amount at the maximum exothermic peak temperature is equal to or more than 120 microW/mg and equal to or less than 400 microW/mg.
8. The epoxy resin composition according to claim 1 ,
wherein the imidazole-based curing accelerator includes one or more selected from the group consisting of 2-phenylimidazole, 2-methylimidazole, 2-phenyl-4-methylimidazole, and 2-phenyl-4-methyl-5 -hydroxymethylimidazole.
9. The epoxy resin composition according to claim 1 ,
wherein the number of functional groups of the imidazole-based curing accelerator is equal to or less than 3.
10. The epoxy resin composition according to claim 1 ,
wherein the curing accelerator includes another kind of the imidazole-based curing accelerator.
11. The epoxy resin composition according to claim 1 ,
wherein the curing agent includes a phenol resin-based curing agent.
12. The epoxy resin composition according to claim 1 ,
wherein the inorganic filler includes a filler having an average particle diameter D50 equal to or more than 1 μm and equal to or less than 50 μm.
13. The epoxy resin composition according to claim 1 ,
wherein the inorganic filler includes a filler having another average particle diameter D50.
14. The epoxy resin composition according to claim 1 ,
wherein the inorganic filler includes fused silica.
15. The epoxy resin composition according to claim 1 ,
wherein the epoxy resin composition has a powdery, granular, tablet-like, or sheet-like shape.
16. The epoxy resin composition according to claim 1 ,
wherein the epoxy resin composition is used in a resin composition for sealing or a resin composition for fixing.
17. A structure comprising a cured product of the epoxy resin composition according to claim 1 .
18. The epoxy resin composition according to claim 1 ,
wherein a content of the inorganic filler is equal to or more than 70% by mass and equal to or less than 95% by mass with respect to the total solid content of the epoxy resin composition.