IP Library Granted Patent US 11,037,800
Granted Patent B2
US 11,037,800 · App. 16/351,274 · Granted Jun 15, 2021

Patterning methods

Inventors: Tsuyoshi Tomoyama (Hiroshima, JP); Hiromitsu Oshima (Hiroshima, JP); Tomohiro Iwaki (Hiroshima, JP)
Assignee: Micron Technology, Inc.
H01L21/32139H01L21/0337H01L21/565H01L27/10888
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,037,800
App. No.
16/351,274
Granted
Jun 15, 2021
Kind
B2
Abstract

Some embodiments include a method of patterning a target material. An assembly is provided which has a masking material over the target material. First lines are formed over the assembly. The first lines extend along a first direction and are laterally spaced from one another by first spaces. Second lines are formed over the first lines. The second lines extend along a second direction which crosses the first direction, and are laterally spaced from one another by second spaces. The second lines cross the first lines at first crossing regions. The second spaces cross the first spaces at second crossing regions. A pattern includes the first and second crossing regions. The pattern is transferred into the masking material to form holes in the masking material in locations directly under the first and second crossing regions. The holes are extended into the target material.

Claims (25)

1. A method of patterning a target material, comprising:

forming an assembly comprising a masking material over the target material; the masking material having a first upper surface;

forming first lines over the assembly; the first lines extending along a first direction and being laterally spaced from one another by first spaces;

forming a mold material over the first lines and within the first spaces; the mold material having a second upper surface;

forming second lines over the second upper surface; the second lines extending along a second direction which crosses the first direction, and being laterally spaced from one another by second spaces;

patterning the mold material with the second lines to form a first pattern within the mold material; the first pattern having third lines aligned with the second lines and having third spaces aligned with the second spaces; the first pattern having first gap regions within the third spaces and directly over the first lines, and having second gap regions within the third spaces and directly over the first spaces;

transferring the second gap regions of the first pattern into the masking material with a first etch to form first openings extending into the masking material;

removing the second lines;

transferring the first gap regions of the first pattern into the first lines with a second etch to pattern the first lines into pillars;

forming additional mold material within the first pattern, within the first openings, and between the pillars; the additional mold material filling the first pattern to form a mold material mass having a third upper surface;

removing an upper region of the mold material mass to form a fourth upper surface that extends along the pillars and along regions of the mold material mass between the pillars;

removing the pillars to leave second openings extending through the mold material mass;

extending the second openings into the masking material; the first and second openings within the masking material together forming a second pattern; and

transferring the second pattern from the masking material to the target material.

2. The method of claim 1 wherein the removing of the second lines is conducted prior to the forming of the first openings in the masking material.

3. The method of claim 1 wherein the removing of the second lines is conducted after the forming of the first openings in the masking material.

4. The method of claim 1 wherein the mold material comprises carbon.

5. The method of claim 4 wherein the mold material is formed by a spin-on process.

6. The method of claim 1 further comprising forming spacers within the first and second openings of the second pattern prior to transferring the second pattern to the target material.

7. The method of claim 6 wherein the spacers are formed within the second openings after the spacers are formed within the first openings.

8. The method of claim 6 wherein the spacers are simultaneously formed within the first and second openings.

9. The method of claim 1 wherein the first lines have a first width along the second direction and the second lines have a second width along the first direction; and wherein the second width is about the same as the first width.

10. The method of claim 1 wherein the first lines have a first width along the second direction and the second lines have a second width along the first direction; and wherein the second width is different than the first width.

11. The method of claim 1 wherein the first spaces have a first width along the second direction and the second spaces have a second width along the first direction; and wherein the second width is about the same as the first width.

12. The method of claim 1 wherein the first spaces have a first width along the second direction and the second spaces have a second width along the first direction; and wherein the second width is different than the first width.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
SUPPLEMENT NO. 12 TO PATENT SECURITY AGREEMENT Recorded Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2019
From: TOMOYAMA, TSUYOSHI; OSHIMA, HIROMITSU; IWAKI, TOMOHIRO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 048578/0621 →
Continuity (1)
Related Publication 20200294814A1 · Sep 17, 2020
Cited By (1)
US 12,699,136