Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board
A semiconductor device assembly that includes a flexible member having a first portion connected to a substrate and a connector attached to a second portion of the flexible member. The connector is electrically connected to the substrate via a conducting layer within the flexible member. The substrate may be a semiconductor device, such as a chip. The connector may be configured to connect the semiconductor device to another semiconductor device assembly or a system board, such as a printed circuit board. A material may encapsulate at least a portion of the substrate of the semiconductor assembly. The semiconductor device assembly may be formed by selectively connecting the flexible member to a first substrate. A second substrate and connector may then be connected to the flexible member. A release layer may be used to release the assembly of the second substrate, flexible member, and connector from the first substrate.
1. A semiconductor device assembly comprising:
a substrate having a first surface and a second surface;
at least one pillar on the second surface of the substrate;
a flexible member having first surface and a second surface opposite of the first surface, the flexible member having traces positioned within the flexible member and at least one pad on the first surface of the flexible member, the flexible member having a first portion adjacent to the substrate and a second portion positioned away from the substrate, wherein the traces are electrically connected to the substrate via an interconnection between the at least one pillar and the at least one pad;
a connector on the second portion of the flexible member, the connector including at least one electrical connection within the connector, wherein the at least one electrical connections of the connector is electrically connected to the substrate via the traces within the flexible member; and
wherein the connector is configured to be inserted into or removed from a corresponding connection without movement of the first portion of the flexible member.
2. The semiconductor device assembly of claim 1 , wherein the second portion of the flexible member may be rolled up into a roll.
3. The semiconductor device assembly of claim 1 , further comprising a mold compound encapsulating at least a portion of the semiconductor device assembly.
4. The semiconductor device assembly of claim 1 , wherein the flexible member further comprises a polyimide film, a polyetheretherketone film, a dielectric material, an organic dielectric material, or a combination thereof.
5. A semiconductor device assembly comprising:
a first substrate;
a release layer on a surface of the first substrate;
a flexible member having an internal conducting layer, a first surface, and a second surface opposite of the first surface, the internal conducting layer being buried within a flexible insulating material of the flexible member, wherein at least a portion of internal conducting layer is exposed on the first surface of the flexible member and wherein the release layer selectively bonds the second surface of the flexible member to the surface of the first substrate;
a connector connected to a portion of the flexible member, an electrical connection within the connector being electrically connected to the internal conducting layer of the flexible member; and
a second substrate being electrically connected to the internal conducting layer of the flexible member via the exposed conducting layer on the first surface of the flexible member, the connector being electrically connected to the second substrate via the internal conducting layer of the flexible member, wherein the release layer is configured to selectively release the flexible member, connector, and second substrate from the first surface of the first substrate.
6. The semiconductor device assembly of claim 5 , wherein the release layer is an optical release layer.
7. The semiconductor device assembly of claim 6 , wherein the release layer is configured to release the flexible member from the surface of the first substrate by the application of heat.
8. The semiconductor device assembly of claim 5 , wherein the first substrate comprises a carrier wafer.
9. The semiconductor device assembly of claim 5 , wherein the first substrate comprises glass, silicon, or a combination thereof.
10. The semiconductor device assembly of claim 5 , wherein the release layer is configured to release the flexible member from the surface of the first substrate by the application of a solvent.
11. The semiconductor device assembly of claim 5 , wherein the release layer is configured to release the flexible member from the surface of the first substrate by the application of a laser.