Antenna feeder package structure and packaging method
The present disclosure provides an antenna package structure and packaging method. The package structure includes: a metal joint pin fabricated by using a wire bonding process; and a packaging layer, covering the metal joint pin. An antenna circuit chip and an antenna metal layer are electrically connected to two ends of the antenna feeder package structure.
1. A method for fabricating an antenna feeder package, comprising:
providing a supporting substrate having a separation layer on the supporting substrate;
forming a patterned first antenna metal layer on the separation layer;
mounting a first metal joint pin on the patterned first antenna metal layer by using a wire bonding process;
depositing a first packaging layer to cover the first metal joint pin;
polishing the first packaging layer to expose a top surface of the first metal joint pin;
forming a patterned second antenna metal layer directly contacting the top surface of the first metal joint pin;
mounting a second metal joint pin on the patterned second antenna metal layer by using the wire bonding process;
depositing a second packaging layer to cover the second metal joint pin;
polishing the second packaging layer to expose a top surface of the second metal joint pin;
forming a first portion of a conductive redistribution layer, wherein the first portion is in direct contact with the top surface of the second metal joint pin;
forming a second portion of the conductive redistribution layer, wherein the second portion is in direct contact with a metal solder ball;
forming a third portion of the conductive redistribution layer, wherein the third portion is in direct contact with pads of an antenna circuit chip, wherein a bottom filling layer is disposed outside the pads and between the third portion of the conductive redistribution layer and the antenna circuit chip; and
remove the supporting substrate by peeling off the separation layer.
2. The method for fabricating an antenna feeder package according to claim 1 , wherein the wire bonding process comprises one of a thermos-compression bonding process, an ultrasonic wire bonding process, and a thermos-compression ultrasonic wire bonding process.
3. The method for fabricating an antenna feeder package according to claim 1 , wherein depositing the first packaging layer to cover the first metal joint pin and depositing the second packaging layer to cover the second metal joint pin each comprises one of compression molding, transfer molding, hydro-forming, vacuum lamination and spin coating.
4. The method for fabricating an antenna feeder package according to claim 1 , wherein each of polishing the first packaging layer to expose the top surface of the first metal joint pin and polishing the second packaging layer to expose the top surface of the second metal joint pin comprises grinding or planarization by polishing.