IP Library › Granted Patent US 10,928,869
Granted Patent B2
US 10,928,869 · App. 16/355,847 · Granted Feb 23, 2021

Heat dissipation module

Inventors: Chun-Chieh Wang (New Taipei, TW); Wen-Neng Liao (New Taipei, TW); Cheng-Wen Hsieh (New Taipei, TW); Wei-Chin Chen (New Taipei, TW); Jau-Han Ke (New Taipei, TW)
Assignee: Acer Incorporated
G06F1/203H05K7/20318H05K7/20327H05K7/20336
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Quick Facts
Patent No.
US 10,928,869
App. No.
16/355,847
Granted
Feb 23, 2021
Kind
B2
Abstract

A heat dissipation module including a chamber, a first cooling member, and a barrier part is provided. The chamber has an accommodating space, at least one inlet, and at least one outlet. The at least one inlet is disposed in a first side wall of the chamber and communicates with the accommodating space. The at least one outlet is disposed in a second side wall of the chamber away from the at least one inlet and communicates with the accommodating space. The first cooling member is disposed in the accommodating space. The first cooling member has a guiding surface which extends obliquely upward. The barrier part is disposed outside the guiding surface of the first cooling member and has at least one through hole.

Claims (17)

1. A heat dissipation module, comprising:

a chamber having:

an accommodating space;

at least one inlet disposed in a first side wall of the chamber and communicating with the accommodating space; and

at least one outlet disposed in a second side wall of the chamber away from the at least one inlet and communicating with the accommodating space;

a first cooling member disposed in the accommodating space and having a guiding surface extending obliquely; and

a barrier part disposed outside the guiding surface of the first cooling member and having at least one through hole,

wherein the chamber is adapted to contact a heat source, a low-temperature liquid enters the accommodating space through the at least one inlet and passes through the barrier part to contact the first cooling member, and the low-temperature liquid forms a high-temperature gas after heat absorption and is guided toward the at least one outlet by the barrier part and the guiding surface to flow out of the accommodating space,

wherein the chamber has a barrier surface connected to the second side wall, and a horizontal width of the barrier surface with respect to the first side wall is gradually increased toward a direction of the at least one outlet.

2. The heat dissipation module according to claim 1 , wherein a vertical height of the guiding surface with respect to a bottom surface of the first cooling member is increased in a direction away from the at least one through hole.

3. The heat dissipation module according to claim 2 , wherein the guiding surface has an angle with respect to an inflow end of the first cooling member, and the angle is greater than 90 degrees and less than 180 degrees.

4. The heat dissipation module according to claim 1 , wherein the barrier part is a heat insulating material.

5. The heat dissipation module according to claim 1 , wherein the first cooling member has a limiting surface which extends obliquely in a direction away from the barrier part.

6. The heat dissipation module according to claim 1 , wherein the first cooling member has a baffle which is disposed at a top of the first cooling member and is partially protruded and suspended in the accommodating space.

7. The heat dissipation module according to claim 1 , wherein the first side wall and the second side wall are disposed to be perpendicular to each other.

8. The heat dissipation module according to claim 1 , further comprising at least one circulation line which communicates with the accommodating space by the at least one inlet and the at least one outlet, respectively.

9. The heat dissipation module according to claim 8 , further comprising a plurality of second cooling fins which are disposed at a periphery of the at least one circulation line and are relatively away from the at least one inlet.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2019
From: WANG, CHUN-CHIEH; LIAO, WEN-NENG; HSIEH, CHENG-WEN; CHEN, WEI-CHIN; KE, JAU-HAN
To: ACER INCORPORATED
Reel/Frame 048707/0268 →
Priority Claims (1)
TW 107143651 A · Dec 5, 2018 · national
Continuity (1)
Related Publication 20200183469A1 · Jun 11, 2020