IP Library Granted Patent US 10,775,669
Granted Patent B2
US 10,775,669 · App. 16/365,037 · Granted Sep 15, 2020

Light emitting module

Inventors: Mamoru Imada (Anan, JP); Toshiaki Moriwaki (Itano-gun, JP); Yusaku Achi (Tokushima, JP)
Assignee: NICHIA CORPORATION
G02F1/133611G02B6/00G02B6/0021G02B6/0025G02B6/0026G02F1/133603G02F1/133606H01L25/0753H01L33/52G02F2001/133614H01L33/505H01L33/58H01L2933/0091
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Quick Facts
Patent No.
US 10,775,669
App. No.
16/365,037
Granted
Sep 15, 2020
Kind
B2
Abstract

A light emitting module includes a light transmissive light guiding plate, a light adjustment portion, and a light emitting element. The light guiding plate has a first main surface serving as a light emitting surface which emits light outside, and a second main surface opposite to the first main surface. The second main surface is provided with a recess. The light adjustment portion is disposed in the recess of the light guiding plate. The light emitting element is bonded to the light adjustment portion. The light adjustment portion includes a wavelength conversion portion and a light diffusion portion. The light diffusion portion has a wavelength conversion portion side on which the wavelength conversion portion is bonded. The light diffusion portion is disposed on a bottom of the recess. The wavelength conversion portion is bonded to the light emitting element.

Claims (37)

1. A light emitting module comprising:

a light-transmissive light guiding plate having a first main surface serving as a light emitting surface which emits light outside, and a second main surface opposite to the first main surface, the second main surface being provided with a recess;

a light adjustment portion disposed in the recess of the light guiding plate;

a light emitting element bonded to the light adjustment portion;

a light emitting element unit comprising the light emitting element and the light adjustment portion,

wherein the light adjustment portion comprises

a wavelength conversion portion and

a light diffusion portion having a wavelength conversion portion side on which the wavelength conversion portion is bonded,

wherein the light diffusion portion is disposed on a bottom of the recess,

wherein the wavelength conversion portion is bonded to the light emitting element,

wherein the wavelength conversion portion and the light diffusion portion are stacked, and the light emitting element is attached to the light adjustment portion,

wherein the light emitting element unit comprises a first encapsulating resin which has outer lateral surfaces, and

wherein the outer lateral surfaces of the first encapsulating resin is substantially coplanar with outer lateral surfaces of the light adjustment portion or the wavelength conversion portion.

2. The light emitting module according to claim 1 ,

wherein the light adjustment portion is positioned in the recess, and

wherein the light emitting element is positioned outside the recess.

3. The light emitting module according to claim 1 , wherein the light diffusion portion comprises a protrusion on the wavelength conversion portion side.

4. The light emitting module according to claim 1 , further comprising,

an encapsulating resin embedding the light emitting element, the encapsulating resin being stacked on the second main surface of the light guiding plate.

5. The light emitting module according to claim 1 , further comprising

a second encapsulating resin embedding the light emitting element unit, the second encapsulating resin being stacked on the second main surface of the light guiding plate.

6. The light emitting module according to claim 5 , wherein the light emitting element unit embedded in the first encapsulating resin is embedded in the second encapsulating resin.

7. The light emitting module according to claim 1 , wherein at least one of the first encapsulating resin and the second encapsulating resin comprise a white resin.

8. The light emitting module according to claim 1 , wherein both the first encapsulating resin and the second encapsulating resin comprise a white resin.

9. The light emitting module according to claim 1 ,

wherein the light emitting element comprises:

a light emission surface; and

an electrode-formed surface opposite to the light emission surface, and

wherein the light adjustment portion is bonded to the light emission surface.

10. The light emitting module according to claim 1 ,

wherein the light-transmissive light guiding plate comprises an optically functional portion on the first main surface side.

11. The light emitting module according to claim 1 ,

wherein the light emitting element unit further comprises an insertion portion disposed in the recess, and

wherein an inner surface outline of the recess has a quadrangular shape, and an outline of the insertion portion in the recess has a quadrangular shape.

12. The light emitting module according to claim 1 , further comprising a bonding wall located in a ring gap formed between the light adjustment portion and the recess.

13. The light emitting module according to claim 12 , wherein the bonding wall is made of a light-transmissive bonding agent.

14. The light emitting module according to claim 12 , wherein a volumetric capacity of the ring gap is larger than a volume of the light adjustment portion of the light emitting element unit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2019
From: IMADA, MAMORU; MORIWAKI, TOSHIAKI; ACHI, YUSAKU
To: NICHIA CORPORATION
Reel/Frame 048717/0892 →
Priority Claims (2)
JP 2018-059065 · Mar 26, 2018 · national
JP 2019-056066 · Mar 25, 2019 · national
Continuity (1)
Related Publication 20190294005A1 · Sep 26, 2019