IP Library Granted Patent US 11,458,038
Granted Patent B2
US 11,458,038 · App. 16/365,567 · Granted Oct 4, 2022

Heat exchange module, system and method

Inventors: Julio L. Vergara (Los Angeles, CA); Daniel M. Estrada (Los Angeles, CA); Mayank Kalra (Los Angeles, CA); Andrew Padula (Laguna Niguel, CA); Daniel E. Cuadra (Los Angeles, CA); Ryan C. Cohn (Los Angeles, CA)
Assignees: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA; HYPOTHERMIA DEVICES, INC.
A61F7/0053A61F7/08A61F2007/0008A61F2007/0054A61F2007/0056A61F2007/0075A61F2007/0076A61F2007/0096A61F2007/0233A61F2007/0234
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Quick Facts
Patent No.
US 11,458,038
App. No.
16/365,567
Granted
Oct 4, 2022
Kind
B2
Abstract

A heat exchange module having a heat transfer fluid channel and a heat transfer plate in heat transfer relation with fluid in the channel. The reference side of a thermoelectric cooler (TEC) is in thermal contact with the plate. A heat transfer tile is in thermal contact with a user side of the TEC. The module is configured to be operatively positionable with the tile in heat transfer relation with skin of a patient.

Claims (30)

1. A heat exchange module comprising:

a thermoelectric cooler (TEC) assembly with a heat transfer fluid channel configured for retaining a heat transfer fluid;

at least one thermoelectric cooler (TEC) having a reference side in thermal contact with at least one thermally conductive plate;

a flexible frame having one or more openings;

at least one thermal transfer tile retained within said flexible frame and held in thermal contact with a user side of the TEC which is opposite to said reference side of the TEC, and the module being configured to be operatively positionable with the tile in heat transfer relation with skin of a patient;

one or more temperature sensors, each said temperature sensor in thermal communication with one of said at least one thermally conductive tile for detecting temperature of the skin of the patient; and

wherein a liquid chamber box of said thermoelectric cooler (TEC) assembly comprises a first and second sheet of thermoplastic material that is formed and adhered together forming the heat-transfer channel therebetween, and in which said second sheet of thermoplastic material is configured with one or more openings, wherein each of said at least one thermally conductive plate is received by and seals over a respective opening of said one or more openings in said second sheet of thermoplastic material; whereby each of said at least one thermally conductive plate is positioned to be in direct contact with heat transfer fluid flowing through said heat transfer fluid channel.

2. The heat exchange module of claim 1 , wherein said at least one TEC is held in sandwich relation between said at least one thermally conductive plate and said at least one thermal tile.

3. The heat exchange module of claim 2 , further comprising a screw passing through one of said at least one thermal tile and one of said at least one thermoelectric cooler (TEC), into one of said at least one thermally conductive plate; wherein one said thermal tile and one said thermoelectric cooler are retained to one said thermally conductive plate.

4. The heat exchange module of claim 2 , wherein each said at least one thermoelectric cooler (TEC) is configured to be held in a sandwich relation between said at least one thermally conductive plate and said at least one thermal tile which interconnect with a snap-fit mechanism.

5. The heat exchange module of claim 4 :

wherein said snap-fit mechanism comprises a first hook attached to said at least one thermally conductive plate provides a snap-fit engagement with a second hook attached to said at least one thermal tile, between which one of said at least one thermoelectric cooler (TEC) is retained; and

wherein said snap-fit mechanism is configured for being engaged by bringing said at least one thermally conductive plate and said at least one thermal tile into either horizontal or vertical engagement to retain each said TEC.

6. The heat exchange module of claim 1 , further comprising a third sheet of thermoplastic material attached to said first and second sheets of thermoplastic material and formed to attach to a distal portion of each of said at least one thermally conductive plate.

7. A heat exchange assembly, comprising:

a liquid chamber box configured with a heat-transfer fluid channel;

a plurality of thermally conductive plates retained on the heat transfer fluid channel and configured for heat transfer relation with fluid in the fluid channel;

a plurality of thermoelectric coolers (TECs), the reference side of each in thermal contact with an associated thermally conductive plate;

a flexible frame having a plurality of openings;

a plurality of thermally conductive tiles, each of which is retained within said flexible frame in thermal contact with a user side of one of said plurality of thermoelectric coolers (TECs) with said module configured to be operatively positionable with the tile in heat transfer relation with skin of a patient;

wherein each of said plurality of thermoelectric coolers (TECs) is configured for being sandwiched between one of said plurality of thermally conductive plates and one of said plurality of thermally conductive tiles;

wherein each of said plurality of thermally conductive plates and each of said plurality of thermally conductive tiles are configured with a snap-fit mechanism in which at least a first hook on one of said plurality of thermally conductive plates is configured for snap-fit engagement with at least a second hook on said plurality of thermal tiles;

a plurality of temperature sensors, each said temperature sensor in thermal communication with each of said plurality of thermally conductive tiles for detecting temperature of the skin of the patient;

wherein said liquid chamber box comprises a first and second sheet of thermoplastic material that are formed and adhered together forming a heat-transfer fluid channel therebetween, and in which said second sheet of thermoplastic material is configured with one or more openings, wherein each of said plurality of conductive plates is received by and seals over a respective opening of said one or more openings in said second sheet of thermoplastic material; and

wherein each of said plurality of thermally conductive plates is positioned to be in direct contact with heat transfer fluid flowing through said heat transfer fluid channel.

8. The assembly of claim 7 ,

wherein each of said thermally conductive plates comprise fins, nubs or extrusions extending up from each of said plurality of thermally conductive plates into said liquid chamber box to prevent the heat-transfer fluid channel from collapsing when said liquid chamber box is flexed and providing additional heat transfer surface area between the fluid in said heat-transfer fluid channel and each of said plurality of thermally conductive plates.

9. The assembly of claim 7 , further comprising a third sheet of thermoplastic material attached to said first and second sheets of thermoplastic material and formed to attach to a distal portion of each of said plurality of thermally conductive plates.

10. The assembly of claim 7 , further comprising an air bladder proximal said liquid chamber box and configured for being pressurized and deflated to increase user comfort and improved thermal contact between said heat exchange module and the skin of the patient.

11. The assembly of claim 7 , wherein each of said at least one thermally conductive plate is configured with perimeter slots into which said second and third sheets of thermoplastic material are heat pressed or RF welded to create a bond through the slot.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER 15365567 PREVIOUSLY RECORDED ON REEL 050507 FRAME 0526. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Oct 1, 2019
From: VERGARA, JULIO L.; PADULA, ANDREW
To: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Reel/Frame 050597/0845 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2019
From: VERGARA, JULIO L.; PADULA, ANDREW
To: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Reel/Frame 050507/0526 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2019
From: ESTRADA, DANIEL M.; KALRA, MAYANK; COHN, RYAN C; CUADRA, DANIEL E
To: HYPOTHERMIA DEVICES, INC.
Reel/Frame 052384/0669 →
Continuity (3)
Continuation PCTUS2017054196 · Sep 28, 2017
Provisional Application 62400986 · Sep 28, 2016
Related Publication 20190262169A1 · Aug 29, 2019