IP Library Granted Patent US 10,832,029
Granted Patent B2
US 10,832,029 · App. 16/365,994 · Granted Nov 10, 2020

Sensor-compatible overlay

Inventors: Roman Ogirko (Lviv, UA); Hans Klein (Pleasanton, CA); David G. Wright (San Mateo, CA); Igor Kolych (Lviv, UA); Andriy Maharyta (Lviv, UA); Hassane El-Khoury (Pleasanton, CA); Oleksandr Karpin (Lviv, UA); Oleksandr Hoshtanar (Lviv, UA); Igor Kravets (Lviv, UA)
Assignee: Cypress Semiconductor Corporation
G06K9/00053A61B42/10A61B42/20A61B46/10G06K9/0002A61B18/20A61B18/203A61B2017/00057A61B2018/00452A61B2018/00476H01S3/022H01S3/092H01S3/1312H01S3/213
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Quick Facts
Patent No.
US 10,832,029
App. No.
16/365,994
Granted
Nov 10, 2020
Kind
B2
Abstract

A fingerprint sensor-compatible overlay material which uses anisotropic conductive material to enable accurate imaging of a fingerprint through an overlay is disclosed. The anisotropic conductive material has increased conductivity in a direction orthogonal to the fingerprint sensor, increasing the capacitive coupling of the fingerprint to the sensor surface, allowing the fingerprint sensor to accurately image the fingerprint through the overlay. Methods for forming a fingerprint sensor-compatible overlay are also disclosed.

Claims (27)

1. A fingerprint sensor-compatible overlay comprising conductive elements disposed in a first portion of material such that the conductive elements are aligned in a first direction from a first surface of the material to a second surface of the material,

wherein a first conductivity in the first direction is greater than a second conductivity in at least one other direction,

wherein the first direction is substantially orthogonal to the first surface at a point at which a fingerprint feature is disposed, and

wherein the conductive elements are distributed within the overlay asymmetrically with measurement electrodes for an array of fingerprint sensors.

2. The overlay of claim 1 , wherein the first conductivity is substantially constant.

3. The overlay of claim 1 , wherein the material is flexible.

4. The overlay of claim 1 , further comprising a second portion of material disposed over the first surface.

5. The overlay of claim 4 , wherein the second portion of material comprises conductive elements disposed in the second portion such that the conductive elements are aligned in the first direction, and wherein the second portion has a third conductivity in the first direction greater than a fourth conductivity in at least one other direction.

6. A method comprising:

forming a plurality of conductive elements over a plurality of measurement electrodes for an array of fingerprint sensors;

wherein the plurality of conductive elements is disposed between a first surface and a second surface, and orthogonal to the first surface at a point at which a fingerprint feature is disposed,

wherein the conductive elements are distributed asymmetrically with the plurality of the measurement electrodes, and

wherein a first conductivity created by the plurality of conductive elements is substantially greater than a second conductivity created by the plurality of conductive elements.

7. The method of claim 6 , wherein the plurality of conductive elements are formed in a flexible material.

8. The method of claim 6 , wherein the plurality of conductive elements are disposed to align with the plurality of measurement electrodes for the array of fingerprint sensors.

9. The method of claim 6 , wherein the plurality of conductive elements are disposed such that they are unaligned with the plurality of measurement electrodes for the array of fingerprint sensors.

10. The method of claim 6 , wherein the first surface is disposed proximate to the plurality of measurement electrodes.

11. The method of claim 6 , wherein the second surface is disposed proximate to at least one feature of a fingerprint.

12. An overlay comprising:

a first surface disposed proximate to a plurality of capacitance measurement electrodes;

a second surface configured to provide a point of contact for a fingerprint feature; and

a material disposed between the first surface and the second surface, the material comprising conductive elements disposed in the material such that the conductive elements are aligned in a first direction from the first surface to the second surface, wherein a first conductivity in the first direction is greater than a second conductivity in at least one other direction,

wherein the conductive elements are distributed within the material asymmetrically with measurement electrodes for an array of fingerprint sensors.

13. The overlay of claim 12 , wherein the first conductivity is substantially constant.

14. The overlay of claim 12 , wherein the first direction is substantially orthogonal to the second surface at a point which the fingerprint feature is disposed.

15. The overlay of claim 12 , wherein the conductive elements correspond to measurement electrodes for an array of fingerprint sensors.

16. The overlay of claim 12 , wherein the conductive elements are in physical contact with at least one of the first surface and the second surface.

Assignments (4)
MERGER Recorded Nov 14, 2025
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 073571/0456 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
SECURITY INTEREST Recorded Jul 31, 2019
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MUFG UNION BANK, N.A.
Reel/Frame 049917/0093 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2019
From: OGIRKO, ROMAN; KLEIN, HANS; WRIGHT, DAVID G.; KOLYCH, IGOR; MAHARYTA, ANDRIY; EL-KHOURY, HASSANE; KARPIN, OLEKSANDR; HOSHTANAR, OLEKSANDR; KRAVETS, IGOR
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 048718/0316 →
Continuity (9)
Continuation 16113374 · Aug 27, 2018
Continuation In Part 15472473 · Mar 29, 2017
Continuation 15347400 · Nov 9, 2016
Continuation 15368905 · Dec 5, 2016
Continuation 15088479 · Apr 1, 2016
Provisional Application 62316451 · Mar 31, 2016
Provisional Application 62255220 · Nov 13, 2015
Provisional Application 62255027 · Nov 13, 2015
Related Publication 20190294855A1 · Sep 26, 2019