Near field communication device and corresponding manufacturing process

1. A Near Field Communication (NFC) device, comprising:

a device support body comprising at least one antenna coil, an integrated circuit coupled to the at least one antenna coil, the at least one antenna coil having a first portion and a second portion, a first terminal of the first portion coupled to a first terminal of the integrated circuit, a first terminal of the second portion coupled to a second terminal of the integrated circuit; and

a photoresistive circuit coupled in series between a second terminal of the first portion of the at least one antenna coil and a second terminal of the second portion of the at least one antenna coil, the photoresistive circuit comprising a photo-resistance, the photoresistive circuit being configured to increase a resistance of the at least one antenna coil when the photo-resistance is in its high resistance state in a dark condition.

2. The NFC device of claim 1 , wherein the device support body comprises a core sheet carrying the integrated circuit and the at least one antenna coil, and wherein the core sheet comprises a recess in which the photo-resistance is mounted.

3. The NFC device of claim 2 , wherein the device support body further comprises an upper sheet and a lower sheet, wherein the core sheet is arranged between the upper sheet and the lower sheet, and wherein at least one of the upper sheet or the lower sheet comprises a window in which the photo-resistance is mounted.

4. The NFC device of claim 1 , wherein the photo-resistance comprises an upper and lower photosensitive surface.

5. The NFC device of claim 1 , wherein the device support body is substantially a planar body.

6. The NFC device of claim 1 , wherein the device support body comprises transparent sheets forming outer surfaces of the device support body.

7. The NFC device of claim 6 , wherein the device support body comprises a core sheet having a passing hole, the core sheet being arranged between the transparent sheets.

8. The NFC device of claim 1 , wherein the photo-resistance is arranged in a cavity in the device support body, and wherein a core sheet of the device support body carries the integrated circuit and the at least one antenna coil.

9. The NFC device of claim 1 , wherein the photo-resistance is arranged on an outer surface of the device support body.

10. The NFC device of claim 1 , wherein the device support body comprises one or more of sheets comprising plastic sheets or paper sheets.

11. A method of manufacturing a near field communication device, the method comprising:

providing a core sheet carrying an integrated circuit and at least one antenna coil, the at least one antenna coil having a first portion and a second portion, a first terminal of the first portion coupled to a first terminal of the integrated circuit, a first terminal of the second portion coupled to a second terminal of the integrated circuit;

arranging the core sheet within a stack of sheets to form a card support body;

laminating the card support body to obtain a device support body; and

arranging at least a photo-resistance electrically connected in series between a second terminal of the first portion of the at least one antenna coil and a second terminal of the second portion of the at least one antenna coil, and wherein at least a photosensitive surface of the photo-resistance is facing outwards from an outer surface of the device support body.

12. The method of claim 11 , wherein the stack of sheets comprises plastic or paper sheets.

13. The method of claim 11 , further comprising:

an upper cover sheet and a lower cover sheet;

forming a window in a vertically corresponding position in at least one of the upper cover sheet or the lower cover sheet;

forming a window in the core sheet;

arranging the photo-resistance in the window in the core sheet; and

stacking the core sheet between the upper cover sheet and the lower cover sheet, wherein stacking comprises inserting the photo-resistance in the window in at least one of the upper cover sheet or the lower cover sheet to obtain the card support body.

14. The method of claim 11 , further comprising:

forming a window in the core sheet;

arranging the photo-resistance in the window in the core sheet, the photo-resistance comprising an upper photosensitive surface and a lower photosensitive surface; and

stacking the core sheet in a stack comprising transparent upper and lower overlay sheets to obtain a sheet stack; and

laminating the sheet stack to obtain the device support body.

15. The method of claim 14 , wherein stacking the core sheet in a stack comprises providing an upper cover sheet and a lower cover sheet between the transparent upper and lower overlay sheets and forming a window in a vertically corresponding position to the window in the core sheet at least in the upper cover sheet and the lower cover sheet.

16. The method of claim 11 , further comprising:

stacking the core sheet between further sheets to form a sheet stack;

laminating the sheet stack to obtain the device support body;

forming, by a milling and embedding process, a cavity in the device support body reaching the core sheet; and

arranging the photo-resistance in the cavity in the core sheet and electrically connecting, by physical soldering or using conductive glue, the photo-resistance to the at least one antenna coil.

17. The method of claim 11 , further comprising arranging the photo-resistance on an outer surface of the device support body and connecting, by physical soldering or conductive glue, the at least one antenna coil to the photo-resistance.

18. The method of claim 11 , wherein a thickness of the card support body is equal to a thickness of the photo-resistance.

19. The method of claim ii, further comprising placing a scratch resistant transparent overlay sheet on outer surfaces of the stack of sheets.

20. A device comprising:

an integrated circuit;

an antenna, the antenna having a first portion and a second portion, a first terminal of the first portion coupled to a first terminal of the integrated circuit, a first terminal of the second portion coupled to a second terminal of the integrated circuit;

a variable resistor coupled in series between a second terminal of the first portion of the antenna and a second terminal of the second portion of the antenna; and

a photoresistive circuit coupled to the variable resistor, the photoresistive circuit configured to increase a resistance of the variable resistor above a threshold in response to the device being in a dark condition, and, based thereon, disable communication at the antenna.