Method of manufacturing light emitting device

1. A method of manufacturing a light emitting device, the method comprising:

mounting a light emitting element on a substrate;

disposing a light shielding frame on a sheet, the light shielding frame having an opening;

disposing a plate-shaped light transmissive member in the opening, the plate-shaped light transmissive member having a first face and a second face opposite the first face, wherein the second face is larger than the first face, wherein an outer perimeter of the first face is smaller than an inner perimeter of the opening, such that the first face opposes the sheet and a space is located between the light transmissive member and the opening, and wherein, in a plan view as seen from above, the light transmissive member is placed such that at least a portion of an outer perimeter of the second face is positioned outward of the inner perimeter of the opening;

forming a light guide support member by filling the space with a first light reflecting member such that the first light reflecting member supports the light shielding frame and the light transmissive member;

bonding the light guide support member by bonding an upper face of the light emitting element and the second face of the light transmissive member, to thereby secure the light guide support member on the light emitting element; and

forming a second light reflecting member surrounding the light emitting element by filling the space between the substrate and the light shielding frame with a second reflecting resin.

2. The method of manufacturing a light emitting device according to claim 1 , further comprising, before the step of forming a light guide support member, forming resin walls at opposing positions spaced from the opening and the light transmissive member with the opening and the light transmissive member interposed between the resin walls.

3. The method of manufacturing a light emitting device according to claim 2 , further comprising, after forming the light guide support member, removing the resin walls.

4. The method of manufacturing a light emitting device according to claim 1 , wherein:

the substrate and the light shielding frame include a plurality of unit regions;

in the mounting step, one or more light emitting elements are mounted in each unit region;

in the step of forming the light guide support member, a light guide support member is formed in each unit region;

in the step of bonding the light guide support member in each unit region, the light guide support member in each unit region is bonded in such a manner as to collectively cover the respective one or more light emitting elements mounted in that unit region;

in the step of forming the second light reflecting member, the space between the substrate and the light shielding frame in each region is filled with the second light reflecting resin; and

the method further comprises, subsequent to the step of forming the second light reflecting member, dividing the substrate into individual unit regions.

5. The method of manufacturing a light emitting device according to claim 1 , further comprising, subsequent to the step of bonding the light guide support member, removing the sheet.

6. The method of manufacturing a light emitting device according to claim 1 , wherein, in the step of bonding the light guide support member, the light transmissive member is bonded such that the outer perimeter of the first face of the light transmissive member is positioned on the inside of an outer perimeter of the light emitting device in a plan view as seen from above.

7. The method of manufacturing a light emitting device according to claim 1 , wherein the light transmissive member contains a phosphor.