Fabrication of compound semiconductor structures
A semiconductor substrate, comprising a first semiconductor material, is provided and an insulating layer is formed thereon; an opening is formed in the insulating layer. Thereby, a seed surface of the substrate is exposed. The opening has sidewalls and a bottom and the bottom corresponds to the seed surface of the substrate. A cavity structure is formed above the insulating layer, including the opening and a lateral growth channel extending laterally over the substrate. A matching array is grown on the seed surface of the substrate, including at least a first semiconductor matching structure comprising a second semiconductor material and a second semiconductor matching structure comprising a third semiconductor material. The compound semiconductor structure comprising a fourth semiconductor material is grown on a seed surface of the second matching structure. The first through fourth semiconductor materials are different from each other. Corresponding semiconductor structures are also included.
1. A method for fabricating a compound semiconductor structure, the method comprising:
providing a semiconductor substrate comprising a first semiconductor material;
forming an insulating layer on the semiconductor substrate;
forming an opening in the insulating layer, thereby exposing a seed surface of the substrate, the opening having sidewalls and a bottom, wherein the bottom corresponds to the seed surface of the substrate;
forming a cavity structure above the insulating layer, the cavity structure comprising the opening and a lateral growth channel extending laterally over the substrate;
growing a matching array on the seed surface of the substrate, the matching array comprising at least a first matching structure comprising a second semiconductor material and a second matching structure comprising a third semiconductor material;
growing the compound semiconductor structure comprising a fourth semiconductor material on a seed surface of the matching array;
wherein the first, the second, the third and the fourth semiconductor material are different from each other;
further comprising providing a geometrical constraint in the growth channel to reduce in plane crystalline defects, wherein the geometrical constraint is an in-plane necking of the growth channel in a plane of a top view of the semiconductor structure.
2. A method for fabricating a compound semiconductor structure, the method comprising:
providing a semiconductor substrate comprising a first semiconductor material;
forming an insulating layer on the semiconductor substrate;
forming an opening in the insulating layer, thereby exposing a seed surface of the substrate, the opening having sidewalls and a bottom, wherein the bottom corresponds to the seed surface of the substrate;
forming a cavity structure above the insulating layer, the cavity structure comprising the opening and a lateral growth channel extending laterally over the substrate;
growing a matching array on the seed surface of the substrate, the matching array comprising at least a first matching structure comprising a second semiconductor material and a second matching structure comprising a third semiconductor material;
growing the compound semiconductor structure comprising a fourth semiconductor material on a seed surface of the matching array;
wherein the first, the second, the third and the fourth semiconductor material are different from each other;
further comprising providing a geometrical constraint in the growth channel to reduce in plane crystalline defects, wherein the geometrical constraint is a change of the in-plane direction of the growth channel in a plane of a top view of the semiconductor structure.