Optical and thermal interface for photonic integrated circuits
Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.
1. An optical apparatus comprising:
an optical interface unit; and
a flip-chip photonic integrated circuit (PIC) including an emitter and an alignment feature on a top side of the flip-chip PIC, the optical interface unit disposed on a bottom side of the flip-chip PIC that is opposite of the top side, the flip-chip PIC having a hole extending from the bottom side to provide a line of sight to the alignment feature via the bottom side of the flip-chip PIC, the emitter to emit light through material of the flip-chip PIC out of the bottom side to the optical interface unit, the alignment feature offset from the emitter on the top side by a predetermined distance value.
2. The optical apparatus of claim 1 , wherein the light from the emitter propagates through semiconductor material of the flip-chip PIC and into the optical interface unit.
3. The optical apparatus of claim 2 , wherein the light expands in propagation in the optical interface unit due to the flip-chip PIC and the optical interface unit having different refraction indices.
4. The optical apparatus of claim 1 , wherein the hole comprises an air gap and is further aligned with one or more components of the flip-chip PIC to provide thermal isolation to the one or more components.
5. The optical apparatus of claim 1 , further comprising:
a spacer material to fill the hole of the flip-chip PIC.
6. The optical apparatus of claim 1 , further comprising:
a heat spreader layer surrounding the optical interface unit and disposed on the bottom side of the flip-chip PIC to spread heat from the flip-chip PIC.
7. The optical apparatus of claim 6 , further comprising:
a structure for aligning an optical connector to the optical interface unit.
8. The optical apparatus of claim 7 , wherein the structure for aligning the optical connector to the optical interface unit is separate from the heat spreader layer, the flip-chip PIC, and the optical interface unit.
9. The optical apparatus of claim 7 , wherein the structure comprises recessed processing features included in the heat spreader layer corresponding to one or more features of the optical connector.
10. The optical apparatus of claim 7 , wherein the structure comprises recessed processing features included in the optical interface unit corresponding to one or more features of the optical connector.
11. The optical apparatus of claim 1 , wherein the offset between the emitter and the alignment feature comprises at least one of a horizontal offset, a vertical offset, or a depth offset.
12. The optical apparatus of claim 1 , wherein the optical interface unit comprises a structure for passively aligning an optical input/output (I/O) interface of an external connector to the emitter of the flip-chip PIC.
13. The optical apparatus of claim 1 , wherein the optical interface unit comprises a lens unit.
14. The optical apparatus of claim 13 , wherein the lens unit comprises a lens array.
15. The optical apparatus of claim 1 , further comprising:
an electrical integrated circuit including control circuitry for one or more devices of the flip-chip PIC and an electrical input/output (I/O) interface; and
an organic substrate.
16. The optical apparatus of claim 15 , wherein the organic substrate is to communicatively couple the flip-chip PIC and the electrical integrated circuit, wherein the electrical I/O interface of the electrical integrated circuit and the top side of the flip-chip PIC are on opposing sides of the organic substrate.
17. The optical apparatus of claim 15 , wherein the electrical integrated circuit is disposed underneath the flip-chip PIC, and the electrical I/O interface is disposed onto the flip-chip PIC to communicatively coupled the electrical integrated circuit to the flip-chip PIC.
18. The optical apparatus of claim 15 , wherein the top side of the flip-chip PIC faces the electrical integrated circuit and the bottom side of the flip-chip PIC faces away from the electrical integrated circuit.